Inventor · disambiguated record
Shinnosuke Maeda
Also filed as: MAEDA SHINNOSUKE
20 granted patents·12 pending applications·85 citations·filing 2009–2016
92Inventor score
Top patents by PatentIndex Score
32 records- 0193US8530751B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 10, 2013·21 cites·20 claims
- 0288US8946906B2Multilayer wiring substrate and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted Feb 3, 2015·11 cites·15 claims
- 0386US8129828B2Wiring substrate with reinforcementMAEDA SHINNOSUKE·Filed 2009·Granted Mar 6, 2012·15 cites·20 claims
- 0485US8362364B2Wiring board assembly and manufacturing method thereofNGK SPARK PLUG CO·Filed 2010·Granted Jan 29, 2013·7 cites·16 claims
- 0583US8389871B2Multilayered wiring board and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted Mar 5, 2013·6 cites·9 claims
- 0682US8707554B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Apr 29, 2014·6 cites·6 claims
- 0780US8581388B2Multilayered wiring substrateMAEDA SHINNOSUKE·Filed 2010·Granted Nov 12, 2013·6 cites·15 claims
- 0877US8233289B2Multilayer wiring substrate and method for manufacturing the sameMAEDA SHINNOSUKE·Filed 2010·Granted Jul 31, 2012·4 cites·9 claims
- 0965US8609995B2Multilayer wiring board and manufacturing method thereofMAEDA SHINNOSUKE·Filed 2011·Granted Dec 17, 2013·3 cites·16 claims
- 1065US8450617B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted May 28, 2013·2 cites·5 claims
- 1164US8847082B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 30, 2014·1 cites·10 claims
- 1264US8535546B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 17, 2013·2 cites·11 claims
- 1359US8826526B2Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Sep 9, 2014·1 cites·7 claims
- 1452US2014215782A1Multilayer wiring substrate, and method of manufacturing the sameNGK SPARK PLUG CO·Filed 2014·Application pending·0 cites
- 1551US9066419B2Multilayer wiring substrateNGK SPARK PLUG CO·Filed 2013·Granted Jun 23, 2015·0 cites·6 claims
- 1651US2014202740A1Method of Manufacturing Multilayer Wiring Substrate, and Multilayer Wiring SubstrateNGK SPARK PLUG CO·Filed 2014·Application pending·0 cites
- 1747US2015027758A1Multilayer wiring substrate and manufacturing method thereforNGK SPARK PLUG CO·Filed 2013·Application pending·0 cites
- 1847US2013161079A1Multi-layer wiring substrate and manufacturing method thereofNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 1947US2013232784A1Method of manufacturing wiring substrateNGK SPARK PLUG CP LTD·Filed 2013·Application pending·0 cites
- 2046US9006580B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2012·Granted Apr 14, 2015·0 cites·10 claims
- 2146US8772643B2Multilayer wiring substrate, and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted Jul 8, 2014·0 cites·7 claims
- 2246US2013111746A1Method of manufacturing multilayer wiring substrateNGK SPARK PLUG CO·Filed 2012·Application pending·0 cites
- 2343US9237656B2Method of manufacturing multi-layer wiring boardNGK SPARK PLUG CO·Filed 2012·Granted Jan 12, 2016·0 cites·3 claims
- 2443US2011155438A1Multilayer Wiring SubstrateNGK SPARK PLUG CO·Filed 2010·Application pending·0 cites
- 2543US2018209699A1Method for preparing adsorption deviceCALSONIC KANSEI CORP·Filed 2016·Application pending·0 cites
- 2643US2015313018A1Wiring substrate and production method thereforNGK SPARK PLUG CO·Filed 2013·Application pending·0 cites
- 2742US2014290997A1Multilayer wiring substrate and manufacturing method thereofNGK SPARK PLUG CO·Filed 2013·Application pending·0 cites
- 2842US2015327362A1Multilayer wiring substrate and production method thereforNGK SPARK PLUG CO·Filed 2013·Application pending·0 cites
- 2939US8859077B2Method of manufacturing multilayer wiring substrate, and multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Oct 14, 2014·0 cites·10 claims
- 3039US8658905B2Multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Granted Feb 25, 2014·0 cites·7 claims
- 3139US2012097319A1Method of manufacturing multilayer wiring substrateMAEDA SHINNOSUKE·Filed 2011·Application pending·0 cites
- 3236US8450622B2Multilayer wiring substrate and method of manufacturing the sameMAEDA SHINNOSUKE·Filed 2011·Granted May 28, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →