Inventor · disambiguated record
Ying-Jiunn Lai
Also filed as: LAI YING-JIUNN
16 granted patents·4 pending applications·95 citations·filing 2003–2014
92Inventor score
Top patents by PatentIndex Score
20 records- 0188US8058956B2High frequency and wide band impedance matching viaJOW UEI-MING·Filed 2010·Granted Nov 15, 2011·11 cites·6 claims
- 0288US7068122B2Miniaturized multi-layer balunIND TECH RES INST·Filed 2004·Granted Jun 27, 2006·27 cites·9 claims
- 0380US7705784B2Multi-frequency antennaWISTRON NEWEB CORP·Filed 2007·Granted Apr 27, 2010·13 cites·30 claims
- 0476US7471166B2Balanced-to-unbalanced transformer embedded with filterIND TECH RES INST·Filed 2006·Granted Dec 30, 2008·7 cites·12 claims
- 0574US7515435B2Multi-functional composite substrate structureIND TECH RES INST·Filed 2006·Granted Apr 7, 2009·5 cites·21 claims
- 0673US8174840B2Multi-functional composite substrate structureJOW UEI-MING·Filed 2008·Granted May 8, 2012·5 cites·41 claims
- 0772US7529103B2Multi-layered printed circuit board embedded with filterIND TECH RES INST·Filed 2006·Granted May 5, 2009·5 cites·10 claims
- 0871US7830241B2Film resistor embedded in multi-layer circuit board and manufacturing method thereofIND TECH RES INST·Filed 2006·Granted Nov 9, 2010·4 cites·21 claims
- 0965US7994885B2High-frequency switch in multi-layer substrateIND TECH RES INST·Filed 2010·Granted Aug 9, 2011·1 cites·7 claims
- 1064US8035036B2Complementary mirror image embedded planar resistor architectureIND TECH RES INST·Filed 2007·Granted Oct 11, 2011·2 cites·12 claims
- 1162US7528433B2Capacitor structureIND TECH RES INST·Filed 2006·Granted May 5, 2009·2 cites·15 claims
- 1254US7446995B2Symmetrical capacitorIND TECH RES INST·Filed 2006·Granted Nov 4, 2008·1 cites·8 claims
- 1353US7102874B2Capacitive apparatus and manufacturing method for a built-in capacitor with a non-symmetrical electrodeIND TECH RES INST·Filed 2004·Granted Sep 5, 2006·6 cites·7 claims
- 1452US6969912B2Embedded microelectronic capacitor incorporating ground shielding layers and method for fabricationIND TECH RES INST·Filed 2003·Granted Nov 29, 2005·5 cites·21 claims
- 1551US8049512B2Circuit board with embedded components and manufacturing and measuring method thereofIND TECH RES INST·Filed 2007·Granted Nov 1, 2011·1 cites·6 claims
- 1644US7936243B2Adjustable resistor embedded in multi-layered substrate and method for forming the sameIND TECH RES INST·Filed 2006·Granted May 3, 2011·0 cites·18 claims
- 1744US2006158280A1High frequency and wide band impedance matching viaJOW UEI-MING·Filed 2005·Application pending·0 cites
- 1842US2006176123A1High-frequency switch in multi-layer substrateIND TECH RES INST·Filed 2005·Application pending·0 cites
- 1940US2015271914A1Integrated circuitLAI YING-JIUNN·Filed 2014·Application pending·0 cites
- 2038US2012061129A1Circuit board structure with low capacitanceLAI YING-JIUNN·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Ying-Jiunn Lai files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →