Inventor · disambiguated record
Mitsumi Ito
Also filed as: ITO MITSUMI
7 granted patents·4 pending applications·141 citations·filing 2000–2010
85Inventor score
Top patents by PatentIndex Score
11 records- 0187US6434730B1Pattern forming methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2000·Granted Aug 13, 2002·68 cites·8 claims
- 0281US7831949B2Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuitPANASONIC CORP·Filed 2007·Granted Nov 9, 2010·9 cites·41 claims
- 0380US7062732B2Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device for generating pattern used for semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jun 13, 2006·30 cites·21 claims
- 0476US7171645B2Semiconductor device, method of generating pattern for semiconductor device, method of manufacturing semiconductor device and device of generating pattern used for semiconductor deviceMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Jan 30, 2007·22 cites·18 claims
- 0563US7269807B2Area ratio/occupancy ratio verification method and pattern generation methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Granted Sep 11, 2007·10 cites·13 claims
- 0646US7707523B2Method of fabricating a semiconductor device and a method of generating a mask patternPANASONIC CORP·Filed 2006·Granted Apr 27, 2010·0 cites·3 claims
- 0745US7115478B2Method of fabricating a semiconductor device and a method of generating a mask patternMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2003·Granted Oct 3, 2006·2 cites·6 claims
- 0844US2011012260A1Method of designing semiconductor integrated circuit, designing apparatus, semiconductor integrated circuit system, semiconductor integrated circuit mounting substrate, package and semiconductor integrated circuitPANASONIC CORP·Filed 2010·Application pending·0 cites
- 0944US2005141764A1Pattern analysis method and pattern analysis apparatusMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2004·Application pending·0 cites
- 1040US2006237852A1Semiconductor device in which LSI chip is arranged on package substrate in flipped condition and substrate wiring designing methodMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2006·Application pending·0 cites
- 1134US2002109205A1Semiconductor device, method of creating pattern of the same, method of manufacturing the same, and apparatus for creating pattern of the sameMATSUSHITA ELECTRIC INDUSTRIAL CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →