Inventor · disambiguated record
Colin Gormley
Also filed as: GORMLEY COLIN · GORMLEY COLIN STEPHEN
9 granted patents·2 pending applications·65 citations·filing 2000–2004
86Inventor score
Files withANALOG DEVICES INC9
Top patents by PatentIndex Score
11 records- 0172US6818564B1Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrateANALOG DEVICES INC·Filed 2002·Granted Nov 16, 2004·17 cites·28 claims
- 0263US7122416B2Method for forming a filled trench in a semiconductor layer of a semiconductor substrate, and a semiconductor substrate with a semiconductor layer having a filled trench thereinANALOG DEVICES INC·Filed 2003·Granted Oct 17, 2006·13 cites·39 claims
- 0362US6964882B2Fabricating complex micro-electromechanical systems using a flip bonding techniqueANALOG DEVICES INC·Filed 2002·Granted Nov 15, 2005·11 cites·9 claims
- 0462US6933163B2Fabricating integrated micro-electromechanical systems using an intermediate electrode layerANALOG DEVICES INC·Filed 2002·Granted Aug 23, 2005·14 cites·7 claims
- 0560US7531842B2Method for etching a tapered bore in a silicon substrate, and a semiconductor wafer comprising the substrateANALOG DEVICES INC·Filed 2004·Granted May 12, 2009·8 cites·25 claims
- 0646US6797591B1Method for forming a semiconductor device and a semiconductor device formed by the methodANALOG DEVICES INC·Filed 2000·Granted Sep 28, 2004·2 cites·39 claims
- 0740US7041528B2Method for forming a micro-mechanical component in a semiconductor wafer, and a semiconductor wafer comprising a micro-mechanical component formed thereinANALOG DEVICES INC·Filed 2003·Granted May 9, 2006·0 cites·35 claims
- 0839US2005045994A1Method for forming a semiconductor device, and a semiconductor device formed by the methodFiled 2004·Application pending·0 cites
- 0937US6723579B2Semiconductor wafer comprising micro-machined components and a method for fabricating the semiconductor waferANALOG DEVICES INC·Filed 2002·Granted Apr 20, 2004·0 cites·19 claims
- 1036US7045869B2Semiconductor wafer comprising micro-machined componentsANALOG DEVICES INC·Filed 2004·Granted May 16, 2006·0 cites·24 claims
- 1135US2004063237A1Fabricating complex micro-electromechanical systems using a dummy handling substrateFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →