Inventor · disambiguated record
Ae-Nee Jang
Also filed as: JANG AE-NEE
30 granted patents·13 pending applications·40 citations·filing 2013–2025
95Inventor score
Top patents by PatentIndex Score
43 records- 0196US11610785B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
- 0294US11869775B2Semiconductor packagesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Jan 9, 2024·2 cites·20 claims
- 0391US11769746B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 26, 2023·2 cites·20 claims
- 0489US11257793B2Semiconductor devices and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Feb 22, 2022·2 cites·20 claims
- 0589US11056414B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 6, 2021·4 cites·19 claims
- 0687US11329032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted May 10, 2022·2 cites·20 claims
- 0781US10211176B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 19, 2019·3 cites·13 claims
- 0879US10930602B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 23, 2021·2 cites·20 claims
- 0978US11955399B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Apr 9, 2024·0 cites·20 claims
- 1077US12374597B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Granted Jul 29, 2025·0 cites·19 claims
- 1177US9024448B2Lower semiconductor molding die, semiconductor package, and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 5, 2015·4 cites·15 claims
- 1276US9299631B2Stack-type semiconductor packageJANG AE-NEE·Filed 2014·Granted Mar 29, 2016·4 cites·20 claims
- 1375US2025309039A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1473US11133232B2Semiconductor device, method of testing semiconductor device and method of manufacturing semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 28, 2021·1 cites·19 claims
- 1573US9859204B2Semiconductor devices with redistribution padsSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Jan 2, 2018·2 cites·18 claims
- 1671US11664292B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted May 30, 2023·0 cites·11 claims
- 1770US11837577B2System-in-package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1868US9159705B2Semiconductor chip connecting semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Oct 13, 2015·2 cites·19 claims
- 1966US11830853B2Semiconductor devices and methods for manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Nov 28, 2023·0 cites·20 claims
- 2066US9245816B2Semiconductor package and method of manufacturing the semiconductor packageJANG CHUL-YONG·Filed 2014·Granted Jan 26, 2016·2 cites·15 claims
- 2165US12002731B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jun 4, 2024·0 cites·18 claims
- 2265US9570423B2Semiconductor package and method of manufacturing the semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Feb 14, 2017·1 cites·18 claims
- 2365US9373574B2Semiconductor packages and methods of forming the sameJANG AE-NEE·Filed 2013·Granted Jun 21, 2016·2 cites·13 claims
- 2464US11784171B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Oct 10, 2023·0 cites·20 claims
- 2562US11784137B2Semiconductor device and method for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 10, 2023·0 cites·15 claims
- 2662US2025149475A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2760US11398454B2System-in-package moduleSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 26, 2022·0 cites·15 claims
- 2860US9343437B2Semiconductor package devicesJANG AE-NEE·Filed 2015·Granted May 17, 2016·1 cites·19 claims
- 2959US2024170458A1Semiconductor package and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3057US11948919B2Stacked semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 3157US10943881B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 9, 2021·0 cites·10 claims
- 3256US2024055372A1Highly integrated semiconductor device containing multiple bonded diesSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3356US2024096717A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3454US2025157967A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3554US2025158002A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3653US2025157962A1Semiconductor package including dummy pads and manufacturing method for the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3750US2024153886A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 3846US11776866B2Semiconductor module heatspreading lid having integrated separators for multiple chipsSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 3, 2023·0 cites·16 claims
- 3946US11158589B2Semiconductor device and semiconductor package comprising the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 26, 2021·0 cites·20 claims
- 4043US2014103523A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4141US2020035649A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
- 4233US2016064365A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
- 4333US2015357298A1Semiconductor chip, semiconductor package having the same and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →