Inventor · disambiguated record
Yun Je Ji
Also filed as: JI YUN · JI YUN JE
10 granted patents·2 pending applications·25 citations·filing 2001–2023
82Inventor score
Top patents by PatentIndex Score
12 records- 0186US11259404B2Rigid-flexible printed circuit board and electronic component moduleSAMSUNG ELECTRO MECH·Filed 2020·Granted Feb 22, 2022·2 cites·29 claims
- 0283US11206736B1Connection substrate and interposer substrate including the sameSAMSUNG ELECTRO MECH·Filed 2021·Granted Dec 21, 2021·1 cites·20 claims
- 0378US11172574B2Printed circuit board assemblySAMSUNG ELECTRO MECH·Filed 2019·Granted Nov 9, 2021·2 cites·19 claims
- 0478US11076485B2Component mounted board and electronic device comprising the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Jul 27, 2021·1 cites·20 claims
- 0570US12114428B2Electronic component embedded substrateSAMSUNG ELECTRO MECH·Filed 2022·Granted Oct 8, 2024·0 cites·20 claims
- 0669US6672902B2Reducing electromagnetic interference (EMI) emissionsINTEL CORP·Filed 2001·Granted Jan 6, 2004·19 cites·26 claims
- 0761US11963311B2Printed circuit board and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2022·Granted Apr 16, 2024·0 cites·17 claims
- 0857US11882652B2Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2021·Granted Jan 23, 2024·0 cites·17 claims
- 0957US2024172368A1Printed circuit boardSAMSUNG ELECTRO MECH·Filed 2023·Application pending·0 cites
- 1056US11439020B2Electronic component-embedded substrateSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 6, 2022·0 cites·24 claims
- 1155US11315879B2Package substrate and multi-chip package including the sameSAMSUNG ELECTRO MECH·Filed 2020·Granted Apr 26, 2022·0 cites·19 claims
- 1246US2022005765A1Substrate structureSAMSUNG ELECTRO MECH·Filed 2020·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →