Inventor · disambiguated record
Shijo Nagao
Also filed as: NAGAO SHIJO
5 granted patents·1 citations·filing 2015–2020
61Inventor score
Top patents by PatentIndex Score
5 records- 0159US11273525B2Bonding material, method for producing bonding material, and method for producing bonding structureUNIV OSAKA·Filed 2017·Granted Mar 15, 2022·0 cites·14 claims
- 0254US10651143B2Conductive paste having dilatancy, electrode connection structure including the paste, and method for producing the structureSHARP KK·Filed 2017·Granted May 12, 2020·0 cites·3 claims
- 0354US10332853B2Bonding structure and method for producing bonding structureUNIV OSAKA·Filed 2015·Granted Jun 25, 2019·1 cites·18 claims
- 0452US11454601B2Substrate evaluation chip and substrate evaluation deviceUNIV OSAKA·Filed 2020·Granted Sep 27, 2022·0 cites·9 claims
- 0532US11049840B2Bonding deviceUNIV OSAKA·Filed 2017·Granted Jun 29, 2021·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →