Inventor · disambiguated record
Michael Roesner
Also filed as: ROESNER MICHAEL
28 granted patents·6 pending applications·122 citations·filing 2001–2025
94Inventor score
Files withINFINEON TECHNOLOGIES AG27BONNESS ANJA1HIRSCHLER JOACHIM1INFINEON TECHNOLOGIES AUSTRIA1INFINEON TECHNOLOGIES AUSTRIA AG1
Top patents by PatentIndex Score
34 records- 0197US9496193B1Semiconductor chip with structured sidewallsINFINEON TECHNOLOGIES AG·Filed 2015·Granted Nov 15, 2016·38 cites·23 claims
- 0294US9673096B2Method for processing a semiconductor substrate and a method for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted Jun 6, 2017·22 cites·17 claims
- 0389US10032670B2Plasma dicing of silicon carbideINFINEON TECHNOLOGIES AG·Filed 2016·Granted Jul 24, 2018·6 cites·27 claims
- 0482US9704748B2Method of dicing a waferINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 11, 2017·4 cites·35 claims
- 0582US6633379B2Apparatus and method for measuring the degradation of a toolSEMICONDUCTOR 300 GMBH & CO KG·Filed 2001·Granted Oct 14, 2003·26 cites·24 claims
- 0678US6752694B2Apparatus for and method of wafer grindingMOTOROLA INC·Filed 2002·Granted Jun 22, 2004·19 cites·18 claims
- 0774US9610543B2Method for simultaneous structuring and chip singulationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Apr 4, 2017·2 cites·17 claims
- 0874US2025157857A1Component and method of manufacturing a component using an ultrathin carrierINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 0972US11367654B2Component and method of manufacturing a component using an ultrathin carrierINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jun 21, 2022·1 cites·15 claims
- 1070US2022246475A1Component and Method of Manufacturing a Component Using an Ultrathin CarrierINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 1167US10157765B2Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 18, 2018·1 cites·17 claims
- 1263US9368436B2Source down semiconductor devices and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jun 14, 2016·1 cites·21 claims
- 1361US10186458B2Component and method of manufacturing a component using an ultrathin carrierMAYER KARL·Filed 2012·Granted Jan 22, 2019·1 cites·18 claims
- 1460US8815706B2Methods of forming semiconductor devicesHIRSCHLER JOACHIM·Filed 2012·Granted Aug 26, 2014·1 cites·25 claims
- 1558US10672716B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 2, 2020·0 cites·17 claims
- 1657US10005659B2Method for simultaneous structuring and chip singulationINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 26, 2018·0 cites·20 claims
- 1755US11077525B2Method of processing a silicon carbide containing crystalline substrate, silicon carbide chip, and processing chamberINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 3, 2021·0 cites·31 claims
- 1855US10622218B2Segmented edge protection shieldINFINEON TECHNOLOGIES AG·Filed 2017·Granted Apr 14, 2020·0 cites·16 claims
- 1954US11063014B2Semiconductor devices including a metal silicide layer and methods for manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jul 13, 2021·0 cites·9 claims
- 2053US11282805B2Silicon carbide devices and methods for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 2151US10020264B2Integrated circuit substrate and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jul 10, 2018·0 cites·17 claims
- 2251US9793129B2Segmented edge protection shieldINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 17, 2017·0 cites·13 claims
- 2350US9455192B2Kerf preparation for backside metallizationINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 27, 2016·0 cites·20 claims
- 2449US9911686B2Source down semiconductor devices and methods of formation thereofINFINEON TECHNOLOGIES AG·Filed 2016·Granted Mar 6, 2018·0 cites·20 claims
- 2549US2015147850A1Methods for processing a semiconductor workpieceINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2649US2023317666A1Semiconductor device with metal silicide layerINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2748US9449876B2Singulation of semiconductor dies with contact metallization by electrical discharge machiningINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 20, 2016·0 cites·18 claims
- 2846US10643917B2Magnetic phase change material for heat dissipationINFINEON TECHNOLOGIES AG·Filed 2018·Granted May 5, 2020·0 cites·24 claims
- 2945US11195713B2Methods of forming a silicon-insulator layer and semiconductor device having the sameINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 7, 2021·0 cites·15 claims
- 3045US9640419B2Carrier system for processing semiconductor substrates, and methods thereofINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 2, 2017·0 cites·21 claims
- 3145US9059273B2Methods for processing a semiconductor waferINFINEON TECHNOLOGIES AG·Filed 2013·Granted Jun 16, 2015·0 cites·25 claims
- 3239US10373868B2Method of processing a porous conductive structure in connection to an electronic component on a substrateINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2016·Granted Aug 6, 2019·0 cites·20 claims
- 3334US2007187272A1Device for the storage and use of at least one photomask for lithographic projection and method for using the device in an exposure installationBONNESS ANJA·Filed 2006·Application pending·0 cites
- 3430US2016204017A1Embrittlement device, pick-up system and method of picking up chipsINFINEON TECHNOLOGIES AUSTRIA·Filed 2016·Application pending·0 cites
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →