Inventor · disambiguated record
Patrick Hogan
Also filed as: HOGAN PATRICK · HOGAN PATRICK ALAN
21 granted patents·7 pending applications·96 citations·filing 2010–2022
94Inventor score
Top patents by PatentIndex Score
28 records- 0198US10668566B2Fabrication of high-entropy alloy wire and multi-principal element alloy wireSTARCK H C INC·Filed 2017·Granted Jun 2, 2020·24 cites·18 claims
- 0297US11077524B2Additive manufacturing utilizing metallic wireSTARCK H C INC·Filed 2017·Granted Aug 3, 2021·23 cites·20 claims
- 0397US9017762B2Method of making molybdenum-containing targets comprising three metal elementsSTARCK H C INC·Filed 2013·Granted Apr 28, 2015·9 cites·20 claims
- 0494US9945023B2Touch screen device comprising Mo-based film layer and methods thereofSTARCK H C INC·Filed 2015·Granted Apr 17, 2018·3 cites·25 claims
- 0594US8449817B2Molybdenum-containing targets comprising three metal elementsROZAK GARY ALAN·Filed 2010·Granted May 28, 2013·7 cites·23 claims
- 0692US8449818B2Molybdenum containing targetsROZAK GARY ALAN·Filed 2010·Granted May 28, 2013·6 cites·22 claims
- 0791US11392257B2Copper-alloy capping layers for metallization in touch-panel displaysSUN SHUWEI·Filed 2021·Granted Jul 19, 2022·2 cites·21 claims
- 0890US9837253B2Molybdenum containing targets for touch screen deviceSTARCK H C INC·Filed 2015·Granted Dec 5, 2017·2 cites·21 claims
- 0987US9299472B2Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displaysSUN SHUWEI·Filed 2014·Granted Mar 29, 2016·7 cites·22 claims
- 1084US9455283B2Etch chemistries for metallization in electronic devicesHOGAN PATRICK·Filed 2015·Granted Sep 27, 2016·4 cites·27 claims
- 1182US10916569B2Thin-film transistor and method of forming an electrode of a thin-film transistorSUN SHUWEI·Filed 2018·Granted Feb 9, 2021·2 cites·20 claims
- 1281US2020013598A1Molybdenum containing targetsSTARCK H C INC·Filed 2019·Application pending·0 cites
- 1381US2022126402A1Fabrication of high-entropy alloy wire and multi-principal element alloy wireSTARCK H C INC·Filed 2021·Application pending·0 cites
- 1480US10023953B2High purity refractory metal powders and their use in sputtering targets which may have random textureSTARCK H C INC·Filed 2015·Granted Jul 17, 2018·2 cites·8 claims
- 1580US2021354242A1Additive manufacturing utilizing metallic wireSTARCK H C INC·Filed 2021·Application pending·0 cites
- 1679US11753702B2Molybdenum containing targetsSTARCK H C INC·Filed 2020·Granted Sep 12, 2023·0 cites·17 claims
- 1777US11640222B2Copper-alloy capping layers for metallization in touch-panel displaysSUN SHUWEI·Filed 2022·Granted May 2, 2023·0 cites·20 claims
- 1877US10186530B2Etch chemistries for metallization in electronic devicesHOGAN PATRICK·Filed 2016·Granted Jan 22, 2019·2 cites·36 claims
- 1976US10829849B2Molybdenum containing targetsSTARCK H C INC·Filed 2018·Granted Nov 10, 2020·0 cites·24 claims
- 2075US11198197B2Fabrication of high-entropy alloy wire and multi-principal element alloy wireSTARCK H C INC·Filed 2020·Granted Dec 14, 2021·0 cites·20 claims
- 2173US10923514B2Etch chemistries for metallization in electronic devicesHOGAN PATRICK·Filed 2018·Granted Feb 16, 2021·1 cites·14 claims
- 2273US9929187B2Copper-alloy capping layers for metallization in touch-panel displaysSUN SHUWEI·Filed 2014·Granted Mar 27, 2018·2 cites·31 claims
- 2370US10403483B2Molybdenum containing targetsSTARCK H C INC·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
- 2462US2013156967A1Spray rejuvenation of sputtering targetsMICHALUK CHRISTOPHER·Filed 2012·Application pending·0 cites
- 2559US2019032196A1High purity refractory metal powders and their use in sputtering targets which may have random textureSTARCK H C INC·Filed 2018·Application pending·0 cites
- 2658US2016076138A1Spray rejuvenation of sputtering targetsMICHALUK CHRISTOPHER·Filed 2015·Application pending·0 cites
- 2755US9150955B2Method of making molybdenum containing targets comprising molybdenum, titanium, and tantalum or chromiumSTARCK H C INC·Filed 2013·Granted Oct 6, 2015·0 cites·19 claims
- 2853US2016172386A1Copper-alloy barrier layers for metallization in thin-film transistors and flat panel displaysSUN SHUWEI·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →