Inventor · disambiguated record
Sueann Lim Wei Fen
Also filed as: FEN SUEANN LIM WEI
8 granted patents·1 pending application·40 citations·filing 2013–2016
85Inventor score
Files withTEXAS INSTRUMENTS INC9
Top patents by PatentIndex Score
9 records- 0194US9741643B2Leadframe strip with vertically offset die attach pads between adjacent vertical leadframe columnsTEXAS INSTRUMENTS INC·Filed 2016·Granted Aug 22, 2017·9 cites·7 claims
- 0290US9515009B2Packaged semiconductor device having leadframe features preventing delaminationTEXAS INSTRUMENTS INC·Filed 2015·Granted Dec 6, 2016·7 cites·6 claims
- 0387US9324640B1Triple stack semiconductor packageTEXAS INSTRUMENTS INC·Filed 2014·Granted Apr 26, 2016·8 cites·7 claims
- 0485US9184119B2Lead frame with abutment surfaceTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 10, 2015·5 cites·9 claims
- 0583US9691748B2Forming a panel of triple stack semiconductor packagesTEXAS INSTRUMENTS INC·Filed 2016·Granted Jun 27, 2017·4 cites·10 claims
- 0680US9013028B2Integrated circuit package and method of makingTEXAS INSTRUMENTS INC·Filed 2013·Granted Apr 21, 2015·5 cites·8 claims
- 0767US9496206B2Flippable leadframe for packaged electronic system having vertically stacked chips and componentsTEXAS INSTRUMENTS INC·Filed 2015·Granted Nov 15, 2016·1 cites·6 claims
- 0863US9859197B2Integrated circuit package fabricationTEXAS INSTRUMENTS INC·Filed 2015·Granted Jan 2, 2018·1 cites·10 claims
- 0951US2015060123A1Locking dual leadframe for flip chip on leadframe packagesTEXAS INSTRUMENTS INC·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Sueann Lim Wei Fen files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →