Inventor · disambiguated record
Tomoshige Chikai
Also filed as: CHIKAI TOMOSHIGE
10 granted patents·1 pending application·37 citations·filing 2011–2017
85Inventor score
Top patents by PatentIndex Score
11 records- 0189US9368474B2Manufacturing method for semiconductor deviceJ DEVICES CORP·Filed 2015·Granted Jun 14, 2016·8 cites·21 claims
- 0286US10236231B2Semiconductor deviceJ DEVICES CORP·Filed 2017·Granted Mar 19, 2019·5 cites·13 claims
- 0386US9635762B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Apr 25, 2017·6 cites·11 claims
- 0482US8872350B2Semiconductor device and manufacturing method thereofSAWACHI SHIGENORI·Filed 2012·Granted Oct 28, 2014·11 cites·12 claims
- 0580US9553052B2Magnetic shielding package of non-volatile magnetic memory elementJ-DEVICES CORP·Filed 2015·Granted Jan 24, 2017·4 cites·4 claims
- 0662US9362200B2Heat sink in the aperture of substrateJ DEVICES CORP·Filed 2015·Granted Jun 7, 2016·1 cites·20 claims
- 0752US8786110B2Semiconductor device and manufacturing method thereofMARUTANI HISAKAZU·Filed 2011·Granted Jul 22, 2014·2 cites·8 claims
- 0850US10134710B2Semiconductor packageJ DEVICES CORP·Filed 2017·Granted Nov 20, 2018·0 cites·5 claims
- 0947US9601450B2Semiconductor packageJ-DEVICES CORP·Filed 2015·Granted Mar 21, 2017·0 cites·15 claims
- 1046US9922931B2Interconnect structure, printed circuit board, semiconductor device, and manufacturing method for interconnect structureJ DEVICES CORP·Filed 2017·Granted Mar 20, 2018·0 cites·5 claims
- 1143US2015243576A1Semiconductor deviceJ DEVICES CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →