Inventor · disambiguated record
Tennyson Nguty
Also filed as: NGUTY TENNYSON
8 granted patents·1 pending application·12 citations·filing 2014–2022
80Inventor score
Top patents by PatentIndex Score
9 records- 0195US11349053B1Flexible interconnect using conductive adhesiveFACEBOOK TECH LLC·Filed 2020·Granted May 31, 2022·5 cites·20 claims
- 0288US11417792B1Interconnect with nanotube fittingFACEBOOK TECH LLC·Filed 2020·Granted Aug 16, 2022·2 cites·12 claims
- 0387US11374148B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2020·Granted Jun 28, 2022·2 cites·10 claims
- 0485US11239400B1Curved pillar interconnectsFACEBOOK TECH LLC·Filed 2020·Granted Feb 1, 2022·2 cites·19 claims
- 0578US11677051B1Application of underfill via centrifugal forceMETA PLATFORMS TECH LLC·Filed 2020·Granted Jun 13, 2023·1 cites·10 claims
- 0677US11735689B2Dielectric-dielectric and metallization bonding via plasma activation and laser-induced heatingFACEBOOK TECH LLC·Filed 2022·Granted Aug 22, 2023·0 cites·20 claims
- 0777US2022393060A1Curing pre-applied and laser-ablated underfill via a laserFACEBOOK TECH LLC·Filed 2022·Application pending·0 cites
- 0847US11404600B2Display device and its process for curing post-applied underfill material and bonding packaging contacts via pulsed lasersFACEBOOK TECH LLC·Filed 2020·Granted Aug 2, 2022·0 cites·13 claims
- 0935US9307665B2Electrical component packagingNXP BV·Filed 2014·Granted Apr 5, 2016·0 cites·7 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →