Inventor · disambiguated record
Yukitomo Hirochi
Also filed as: HIROCHI YUKITOMO
22 granted patents·8 pending applications·46 citations·filing 2008–2025
93Inventor score
Files withKOKUSAI ELECTRIC CORP17HITACHI INT ELECTRIC INC10HARA DAISUKE1HIROCHI YUKITOMO1YASUI TAKESHI1
Top patents by PatentIndex Score
30 records- 0198US11469083B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Oct 11, 2022·4 cites·17 claims
- 0297US11967490B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2022·Granted Apr 23, 2024·2 cites·17 claims
- 0396US11177143B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Granted Nov 16, 2021·5 cites·20 claims
- 0495US11749510B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2021·Granted Sep 5, 2023·2 cites·19 claims
- 0591US11469081B2Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Oct 11, 2022·4 cites·14 claims
- 0690US9018689B1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Apr 28, 2015·10 cites·6 claims
- 0786US2024249923A1Plasma generating device, substrate processing apparatus, and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2024·Application pending·0 cites
- 0884US9064695B1Substrate processing apparatus, non-transitory computer-readable recording medium and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 23, 2015·5 cites·8 claims
- 0983US11239098B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Feb 1, 2022·3 cites·10 claims
- 1083US10131990B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2017·Granted Nov 20, 2018·3 cites·10 claims
- 1181US9070554B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Jun 30, 2015·4 cites·19 claims
- 1278US9587314B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2014·Granted Mar 7, 2017·1 cites·12 claims
- 1371US11018033B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted May 25, 2021·1 cites·12 claims
- 1470US10475652B2Method of manufacturing semiconductor device, substrate processing apparatus, and recording mediumHITACHI INT ELECTRIC INC·Filed 2018·Granted Nov 12, 2019·1 cites·13 claims
- 1566US2025191921A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2025·Application pending·0 cites
- 1661US12255069B2Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2021·Granted Mar 18, 2025·0 cites·9 claims
- 1757US9084298B2Substrate processing apparatus including shielding unit for suppressing leakage of magnetic fieldHIROCHI YUKITOMO·Filed 2011·Granted Jul 14, 2015·1 cites·7 claims
- 1852US11309195B2Heating element, substrate processing apparatus and method of manufacturing semiconductor deviceKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 19, 2022·0 cites·18 claims
- 1951US2021407865A1Method of Manufacturing Semiconductor Device, Substrate Processing Apparatus and Non-transitory Computer-readable Recording MediumKOKUSAI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 2050US9502236B2Substrate processing apparatus, non-transitory computer-readable recording medium and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2015·Granted Nov 22, 2016·0 cites·13 claims
- 2148US11553565B2Method of manufacturing semiconductor device, substrate processing apparatus, and non-transitory computer-readable recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Jan 10, 2023·0 cites·12 claims
- 2247US11265977B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 1, 2022·0 cites·11 claims
- 2347US2020388515A1Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2020·Application pending·0 cites
- 2446US2017062254A1Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording mediumHITACHI INT ELECTRIC INC·Filed 2015·Application pending·0 cites
- 2546US2009176381A1Method of manufacturing semiconductor device and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2008·Application pending·0 cites
- 2645US11264253B2Substrate processing apparatus, method of manufacturing semiconductor device, and recording mediumKOKUSAI ELECTRIC CORP·Filed 2019·Granted Mar 1, 2022·0 cites·6 claims
- 2745US10633739B2Substrate processing apparatusKOKUSAI ELECTRIC CORP·Filed 2019·Granted Apr 28, 2020·0 cites·20 claims
- 2841US2012067274A1Film forming apparatus, wafer holder, and film forming methodHARA DAISUKE·Filed 2011·Application pending·0 cites
- 2936US2016284543A1Substrate processing apparatus, program and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2016·Application pending·0 cites
- 3030US9028191B2Substrate processing apparatus and method of manufacturing semiconductor deviceYASUI TAKESHI·Filed 2011·Granted May 12, 2015·0 cites·17 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →