Inventor · disambiguated record
Keith Gaff
Also filed as: GAFF KEITH · GAFF KEITH WILLIAM
50 granted patents·2 pending applications·1,066 citations·filing 2005–2023
98Inventor score
Top patents by PatentIndex Score
52 records- 0199US7497614B2Apparatus for determining a temperature of a substrate and methods thereforLAM RES CORP·Filed 2007·Granted Mar 3, 2009·468 cites·25 claims
- 0298US8884194B2Heating plate with planar heater zones for semiconductor processingLAM RES CORP·Filed 2013·Granted Nov 11, 2014·52 cites·20 claims
- 0398US8637794B2Heating plate with planar heating zones for semiconductor processingSINGH HARMEET·Filed 2009·Granted Jan 28, 2014·86 cites·15 claims
- 0497US10056225B2Adjusting substrate temperature to improve CD uniformityLAM RES CORP·Filed 2013·Granted Aug 21, 2018·36 cites·11 claims
- 0597US8624168B2Heating plate with diode planar heater zones for semiconductor processingGAFF KEITH WILLIAM·Filed 2011·Granted Jan 7, 2014·57 cites·17 claims
- 0697US8587113B2Thermal plate with planar thermal zones for semiconductor processingLAM RES CORP·Filed 2013·Granted Nov 19, 2013·40 cites·18 claims
- 0797US8461674B2Thermal plate with planar thermal zones for semiconductor processingGAFF KEITH WILLIAM·Filed 2011·Granted Jun 11, 2013·63 cites·18 claims
- 0896US9922857B1Electrostatically clamped edge ringLAM RES CORP·Filed 2016·Granted Mar 20, 2018·13 cites·18 claims
- 0995US11651991B2Electrostatic Chuck design for cooling-gas light-up preventionLAM RES CORP·Filed 2021·Granted May 16, 2023·2 cites·15 claims
- 1095US9392643B2Heating plate with planar heater zones for semiconductor processingLAM RES CORP·Filed 2013·Granted Jul 12, 2016·12 cites·21 claims
- 1195US9101038B2Electrostatic chuck including declamping electrode and method of declampingLAM RES CORP·Filed 2013·Granted Aug 4, 2015·60 cites·20 claims
- 1295US8642480B2Adjusting substrate temperature to improve CD uniformityGAFF KEITH WILLIAM·Filed 2010·Granted Feb 4, 2014·22 cites·16 claims
- 1394US10236193B2Substrate supports with multi-layer structure including independent operated heater zonesLAM RES CORP·Filed 2017·Granted Mar 19, 2019·6 cites·20 claims
- 1493US7560007B2In-situ wafer temperature measurement and controlLAM RES CORP·Filed 2006·Granted Jul 14, 2009·22 cites·23 claims
- 1592US10720346B2Substrate support with thermal zones for semiconductor processingLAM RES CORP·Filed 2016·Granted Jul 21, 2020·5 cites·25 claims
- 1692US10049948B2Power switching system for ESC with array of thermal control elementsLAM RES CORP·Filed 2012·Granted Aug 14, 2018·14 cites·19 claims
- 1792US9646861B2Heating plate with heating zones for substrate processing and method of use thereofLAM RES CORP·Filed 2013·Granted May 9, 2017·7 cites·25 claims
- 1892US8852964B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2013·Granted Oct 7, 2014·14 cites·18 claims
- 1988US11848177B2Multi-plate electrostatic chucks with ceramic baseplatesLAM RES CORP·Filed 2018·Granted Dec 19, 2023·4 cites·45 claims
- 2088US9412555B2Lower electrode assembly of plasma processing chamberAUGUSTINO JASON·Filed 2009·Granted Aug 9, 2016·17 cites·12 claims
- 2187US11967517B2Electrostatic chuck with ceramic monolithic bodyLAM RES CORP·Filed 2020·Granted Apr 23, 2024·2 cites·18 claims
- 2285US10690414B2Multi-plane heater for semiconductor substrate supportLAM RES CORP·Filed 2015·Granted Jun 23, 2020·5 cites·41 claims
- 2384US10804081B2Edge ring dimensioned to extend lifetime of elastomer seal in a plasma processing chamberLAM RES CORP·Filed 2013·Granted Oct 13, 2020·7 cites·30 claims
- 2484US9869392B2Edge seal for lower electrode assemblySCHAEFER DAVID·Filed 2012·Granted Jan 16, 2018·6 cites·13 claims
- 2583US10923380B2Electrostatically clamped edge ringLAM RES CORP·Filed 2018·Granted Feb 16, 2021·2 cites·13 claims
- 2681US9012243B2Controlling CD and CD uniformity with trim time and temperature on a wafer by wafer basisLAM RES CORP·Filed 2014·Granted Apr 21, 2015·4 cites·15 claims
- 2780US10388493B2Component of a substrate support assembly producing localized magnetic fieldsSINGH HARMEET·Filed 2011·Granted Aug 20, 2019·4 cites·20 claims
- 2880US10083853B2Electrostatic chuck design for cooling-gas light-up preventionLAM RES CORP·Filed 2015·Granted Sep 25, 2018·2 cites·18 claims
- 2979US12368025B2Edge seal for lower electrode assemblyLAM RES CORP·Filed 2023·Granted Jul 22, 2025·0 cites·20 claims
- 3079US9859142B2Edge seal for lower electrode assemblySCHAEFER DAVID·Filed 2011·Granted Jan 2, 2018·5 cites·17 claims
- 3178US11069553B2Electrostatic chuck with features for preventing electrical arcing and light-up and improving process uniformityLAM RES CORP·Filed 2017·Granted Jul 20, 2021·2 cites·16 claims
- 3278US10002782B2ESC assembly including an electrically conductive gasket for uniform RF power delivery therethroughLAM RES CORP·Filed 2014·Granted Jun 19, 2018·3 cites·35 claims
- 3377US12451335B2Multi-plate electrostatic chucks with ceramic baseplatesLAM RES CORP·Filed 2023·Granted Oct 21, 2025·0 cites·41 claims
- 3477US7802917B2Method and apparatus for chuck thermal calibrationLAM RES CORP·Filed 2005·Granted Sep 28, 2010·4 cites·9 claims
- 3576US11024532B2Electrostatic chuck design for cooling-gas light-up preventionLAM RES CORP·Filed 2018·Granted Jun 1, 2021·1 cites·20 claims
- 3674US10892197B2Edge seal configurations for a lower electrode assemblyLAM RES CORP·Filed 2018·Granted Jan 12, 2021·1 cites·16 claims
- 3773US10770363B2Power switching system for ESC with array of thermal control elementsLAM RES CORP·Filed 2018·Granted Sep 8, 2020·1 cites·20 claims
- 3873US10381248B2Auto-correction of electrostatic chuck temperature non-uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·2 cites·14 claims
- 3973US8449174B2Method and apparatus for chuck thermal calibrationGAFF KEITH WILLIAM·Filed 2010·Granted May 28, 2013·2 cites·9 claims
- 4072US10090211B2Edge seal for lower electrode assemblyLAM RES CORP·Filed 2013·Granted Oct 2, 2018·2 cites·19 claims
- 4172US7578616B2Apparatus for determining a temperature of a substrate and methods thereforLAM RES CORP·Filed 2005·Granted Aug 25, 2009·7 cites·22 claims
- 4271US11935776B2Electrostatically clamped edge ringLAM RES CORP·Filed 2021·Granted Mar 19, 2024·0 cites·8 claims
- 4371US11781650B2Edge seal for lower electrode assemblyLAM RES CORP·Filed 2017·Granted Oct 10, 2023·1 cites·13 claims
- 4470US9716022B2Method of determining thermal stability of a substrate support assemblyLAM RES CORP·Filed 2013·Granted Jul 25, 2017·2 cites·21 claims
- 4564US9543171B2Auto-correction of malfunctioning thermal control element in a temperature control plate of a semiconductor substrate support assembly that includes deactivating the malfunctioning thermal control element and modifying a power level of at least one functioning thermal control elementLAM RES CORP·Filed 2014·Granted Jan 10, 2017·1 cites·22 claims
- 4662US12227840B2Substrate support with varying depths of areas between mesas and corresponding temperature dependent method of fabricatingLAM RES CORP·Filed 2022·Granted Feb 18, 2025·0 cites·29 claims
- 4758US10872748B2Systems and methods for correcting non-uniformities in plasma processing of substratesLAM RES CORP·Filed 2019·Granted Dec 22, 2020·0 cites·25 claims
- 4858US10804129B2Electrostatic chuck assembly incorporation a gasket for distributing RF power to a ceramic embedded electrodeLAM RES CORP·Filed 2018·Granted Oct 13, 2020·0 cites·24 claims
- 4956US9530679B2Method and apparatus for chuck thermal calibrationLAM RES CORP·Filed 2013·Granted Dec 27, 2016·0 cites·20 claims
- 5050US10437236B2Method of determining thermal stability of a substrate support assemblyLAM RES CORP·Filed 2017·Granted Oct 8, 2019·0 cites·20 claims
Showing the top 50 of 52 patent records by PatentIndex Score.
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