Inventor · disambiguated record

Benny Wu

Also filed as: WU BENNY

4 granted patents·3 pending applications·7 citations·filing 2015–2024

63Inventor score

Technology areasH10P

Files withLAM RES CORP7

Top patents by PatentIndex Score

7 records

0185US10690414B2Multi-plane heater for semiconductor substrate supportLAM RES CORP·Filed 2015·Granted Jun 23, 2020·5 cites·41 claims
0273US10381248B2Auto-correction of electrostatic chuck temperature non-uniformityLAM RES CORP·Filed 2015·Granted Aug 13, 2019·2 cites·14 claims
0370US2025069866A1In situ real-time sensing and compensation of non-uniformities in substrate processing systemsLAM RES CORP·Filed 2024·Application pending·0 cites
0455US12142464B2In situ real-time sensing and compensation of non-uniformities in substrate processing systemsLAM RES CORP·Filed 2020·Granted Nov 12, 2024·0 cites·17 claims
0547US2023274954A1Substrate supports with multilayer structure including coupled heater zones with local thermal controlLAM RES CORP·Filed 2021·Application pending·0 cites
0647US2025062149A1Electrostatic chucks with self-sealing gas conduits and/or reduced clogging due to residueLAM RES CORP·Filed 2022·Application pending·0 cites
0744US10224187B1Detecting partial unclamping of a substrate from an ESC of a substrate processing systemLAM RES CORP·Filed 2018·Granted Mar 5, 2019·0 cites·20 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →