Inventor · disambiguated record
Makoto Ikemoto
Also filed as: IKEMOTO MAKOTO
11 granted patents·2 pending applications·56 citations·filing 1994–2017
88Inventor score
Top patents by PatentIndex Score
13 records- 0192US7541322B2Cleaning solution for substrate for semiconductor device and cleaning methodMITSUBISHI CHEM CORP·Filed 2006·Granted Jun 2, 2009·22 cites·13 claims
- 0282US9508648B2Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminateMITSUBISHI CHEM CORP·Filed 2013·Granted Nov 29, 2016·6 cites·24 claims
- 0382US7621281B2Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the sameMITSUBISHI CHEM CORP·Filed 2007·Granted Nov 24, 2009·7 cites·19 claims
- 0479US9847298B2Three-dimensional integrated circuit laminate, and interlayer filler for three-dimensional integrated circuit laminateMITSUBISHI CHEM CORP·Filed 2016·Granted Dec 19, 2017·3 cites·11 claims
- 0574US9822294B2Agglomerated boron nitride particles, composition containing said particles, and three-dimensional integrated circuit having layer comprising said compositionMITSUBISHI CHEM CORP·Filed 2014·Granted Nov 21, 2017·3 cites·24 claims
- 0662US8110534B2Cleaning solution for substrate for semiconductor device and process for producing substrate for semiconductor deviceKAWASE YASUHIRO·Filed 2008·Granted Feb 7, 2012·2 cites·12 claims
- 0753US10400151B2Agglomerated boron nitride particles, composition containing said particles, and three- dimensional integrated circuit having layer comprising said compositionMITSUBISHI CHEM CORP·Filed 2017·Granted Sep 3, 2019·0 cites·21 claims
- 0848US9960092B2Interlayer filler composition for three-dimensional integrated circuitMITSUBISHI CHEM CORP·Filed 2013·Granted May 1, 2018·0 cites·34 claims
- 0944US5635329APhotosensitive resin composition and method for forming a pattern using the compositionMITSUBISHI CHEM CORP·Filed 1994·Granted Jun 3, 1997·7 cites·17 claims
- 1043US2005020463A1Cleaning solution for cleaning substrate for semiconductor devices and cleaning method using the sameMITSUBISHI CHEM CORP·Filed 2004·Application pending·0 cites
- 1140US5698362A1,2 quinone diazide photosensitive resin composition containing select additive and method for forming a photoresist patternMITSUBISHI CHEM CORP·Filed 1997·Granted Dec 16, 1997·6 cites·15 claims
- 1233US10125289B2Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor deviceMITSUBISHI CHEM CORP·Filed 2015·Granted Nov 13, 2018·0 cites·13 claims
- 1332US2017287866A1Interlayer filler composition for semiconductor device and method for producing semiconductor deviceMITSUBISHI CHEM CORP·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →