Inventor · disambiguated record
Toshiyuki Nagase
Also filed as: NAGASE TOSHIYUKI
28 granted patents·9 pending applications·490 citations·filing 1990–2024
96Inventor score
Files withMITSUBISHI MATERIALS CORP25TOYOTA MOTOR CO LTD3MITSUBISHI METAL CORP2CANON MEDICAL SYSTEMS CORP1KITAHARA TAKESHI1
Top patents by PatentIndex Score
37 records- 0192US9715263B2BMC processing circuit, USB power delivery controller, BMC reception method, and non-transitory computer readable medium storing BMC reception programRENESAS ELECTRONICS CORP·Filed 2015·Granted Jul 25, 2017·10 cites·10 claims
- 0291US6310775B1Power module substrateMITSUBISHI MATERIALS CORP·Filed 2000·Granted Oct 30, 2001·82 cites·6 claims
- 0390US7532481B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialMITSUBISHI MATERIALS CORP·Filed 2005·Granted May 12, 2009·17 cites·6 claims
- 0489US6033787ACeramic circuit board with heat sinkMITSUBISHI MATERIALS CORP·Filed 1997·Granted Mar 7, 2000·120 cites·10 claims
- 0586US6563709B2Liquid-cooled heat sink and manufacturing method thereofMITSUBISHI MATERIALS CORP·Filed 2001·Granted May 13, 2003·58 cites·9 claims
- 0685US9401340B2Semiconductor device and ceramic circuit substrate, and producing method of semiconductor deviceMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jul 26, 2016·7 cites·3 claims
- 0783US7565467B2USB hub, USB-compliant apparatus, and communication systemNEC ELECTRONICS CORP·Filed 2006·Granted Jul 21, 2009·13 cites·21 claims
- 0880US8164909B2Al/AlN joint material, base plate for power module, power module, and manufacturing method of Al/AlN joint materialNAGASE TOSHIYUKI·Filed 2010·Granted Apr 24, 2012·6 cites·3 claims
- 0978US7128979B2Circuit board, method of producing same, and power moduleMITSUBISHI MATERIALS CORP·Filed 2003·Granted Oct 31, 2006·24 cites·9 claims
- 1077US7019975B2Power module and power module with heat sinkMITSUBISHI MATERIALS CORP·Filed 2001·Granted Mar 28, 2006·26 cites·9 claims
- 1173US5675474AHighly heat-radiating ceramic packageMITSUBISHI MATERIALS CORP·Filed 1995·Granted Oct 7, 1997·51 cites·9 claims
- 1272US2025236245A1Electrified vehicleTOYOTA MOTOR CO LTD·Filed 2024·Application pending·0 cites
- 1370US6483185B1Power module substrate, method of producing the same, and semiconductor device including the substrateMITSUBISHI MATERIALS CORP·Filed 1999·Granted Nov 19, 2002·44 cites·9 claims
- 1468US9764416B2Power module substrate, heat-sink-attached power module substrate, and heat-sink-attached power moduleMITSUBISHI MATERIALS CORP·Filed 2014·Granted Sep 19, 2017·2 cites·25 claims
- 1567US9237682B2Power module substrate with heat sink, and method for producing power module substrate with heat sinkMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 12, 2016·2 cites·4 claims
- 1666US9426915B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted Aug 23, 2016·2 cites·2 claims
- 1765US9642275B2Power moduleMITSUBISHI MATERIALS CORP·Filed 2013·Granted May 2, 2017·2 cites·2 claims
- 1863US8116084B2Method for manufacturing power module substrate, power module substrate, and power moduleKITAHARA TAKESHI·Filed 2008·Granted Feb 14, 2012·3 cites·4 claims
- 1961US11505079B2Hybrid vehicle and method for controlling hybrid vehicleTOYOTA MOTOR CO LTD·Filed 2019·Granted Nov 22, 2022·1 cites·4 claims
- 2056US11724744B2VehicleTOYOTA MOTOR CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·4 claims
- 2152US2008248326A1Ai/ain joint material, base plate for power module, power module, and manufacturing method of ai/ain joint materialMITSUBISHI MATERIALS CORP·Filed 2008·Application pending·0 cites
- 2248US8188376B2Insulation substrate, power module substrate, manufacturing method thereof, and power module using the sameNEGISHI TAKESHI·Filed 2009·Granted May 29, 2012·0 cites·5 claims
- 2346US10121574B2Resistor and method for manufacturing resistorMITSUBISHI MATERIALS CORP·Filed 2016·Granted Nov 6, 2018·0 cites·11 claims
- 2446US8001682B2Insulation substrate, power module substrate, manufacturing method thereof, and power module using the sameMITSUBISHI MATERIALS CORP·Filed 2005·Granted Aug 23, 2011·0 cites·4 claims
- 2544US10607907B2Ceramic-aluminum conjugate, power module substrate, and power moduleMITSUBISHI MATERIALS CORP·Filed 2016·Granted Mar 31, 2020·0 cites·6 claims
- 2644US2019069880A1Ultrasound probe and ultrasound probe manufacturing methodCANON MEDICAL SYSTEMS CORP·Filed 2018·Application pending·0 cites
- 2742US5087509ASubstrate used for fabrication of thick film circuitMITSUBISHI METAL CORP·Filed 1990·Granted Feb 11, 1992·13 cites·20 claims
- 2842US2021352828A1Metal layer-including carbonaceous member and heat conduction plateMITSUBISHI MATERIALS CORP·Filed 2019·Application pending·0 cites
- 2941US9862045B2Power-module substrate and manufacturing method thereofMITSUBISHI MATERIALS CORP·Filed 2013·Granted Jan 9, 2018·0 cites·1 claims
- 3040US2014318831A1Power module substrate, power module substrate with heat sink, power module, paste for forming flux component intrusion-preventing layer and method for bonding bonded bodyMITSUBISHI MATERIALS CORP·Filed 2012·Application pending·0 cites
- 3139US10573798B2Thermoelectric conversion module and thermoelectric conversion deviceMITSUBISHI MATERIALS CORP·Filed 2016·Granted Feb 25, 2020·0 cites·6 claims
- 3237US2004188828A1Heat-conducting multilayer substrate and power module substrateMITSUBISHI MATERIALS CORP·Filed 2003·Application pending·0 cites
- 3335US10037837B2Resistor and method for manufacturing resistorMITSUBISHI MATERIALS CORP·Filed 2015·Granted Jul 31, 2018·0 cites·11 claims
- 3434US5096768ASubstrate used for fabrication of thick film circuitMITSUBISHI METAL CORP·Filed 1990·Granted Mar 17, 1992·7 cites·19 claims
- 3533US2018277729A1Light-emitting module substrate, light-emitting module, substrate for light-emitting module having cooler, and production method for light-emitting module substrateMITSUBISHI MATERIALS CORP·Filed 2016·Application pending·0 cites
- 3633US2018277730A1Light-emission module having cooler and production method for light-emission module having coolerMITSUBISHI MATERIALS CORP·Filed 2016·Application pending·0 cites
- 3729US2012298408A1Substrate for power module and power moduleNAGATOMO YOSHIYUKI·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →