Inventor · disambiguated record
Wei Chi Yih
Also filed as: YIH WEI-CHI
5 granted patents·1 pending application·102 citations·filing 2009–2009
77Inventor score
Top patents by PatentIndex Score
6 records- 0195US8378466B2Wafer-level semiconductor device packages with electromagnetic interference shieldingADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Feb 19, 2013·68 cites·25 claims
- 0292US8053906B2Semiconductor package and method for processing and bonding a wireADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Nov 8, 2011·32 cites·19 claims
- 0355US8110931B2Wafer and semiconductor packageCHANG HSIAO CHUAN·Filed 2009·Granted Feb 7, 2012·1 cites·21 claims
- 0450US8076786B2Semiconductor package and method for packaging a semiconductor packageHUNG CHANG YING·Filed 2009·Granted Dec 13, 2011·1 cites·20 claims
- 0548US8018075B2Semiconductor package, method for enhancing the bond of a bonding wire, and method for manufacturing a semiconductor packageADVANCED SEMICONDUCTOR ENG·Filed 2009·Granted Sep 13, 2011·0 cites·20 claims
- 0639US2010184255A1Manufacturing method for package structureLIU CHIEN·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →