Inventor · disambiguated record
Shing-Hwa Renn
Also filed as: RENN SHING-HWA
11 granted patents·4 pending applications·195 citations·filing 1999–2011
90Inventor score
Top patents by PatentIndex Score
15 records- 0193US8299562B2Isolation structure and device structure including the sameLI CHUNG-REN·Filed 2011·Granted Oct 30, 2012·95 cites·19 claims
- 0293US7948028B2DRAM device having a gate dielectric layer with multiple thicknessesNANYA TECHNOLOGY CORP·Filed 2008·Granted May 24, 2011·32 cites·6 claims
- 0391US8102064B2Electrical alignment mark set and method for aligning wafer stackRENN SHING-HWA·Filed 2010·Granted Jan 24, 2012·16 cites·11 claims
- 0487US8653584B2Dual vertical channel transistor and fabrication method thereofRENN SHING-HWA·Filed 2010·Granted Feb 18, 2014·12 cites·23 claims
- 0587US7948027B1Embedded bit line structure, field effect transistor structure with the same and method of fabricating the sameNANYA TECHNOLOGY CORP·Filed 2009·Granted May 24, 2011·16 cites·18 claims
- 0672US8227840B2Integrated circuit device and method of forming the sameWANG CHARLES C·Filed 2010·Granted Jul 24, 2012·4 cites·13 claims
- 0760US8063404B2Semiconductor memory deviceRENN SHING-HWA·Filed 2010·Granted Nov 22, 2011·1 cites·20 claims
- 0856US6200859B1Method of fabricating a split-gate flash memoryWINBOND ELECTRONICS CORP·Filed 1999·Granted Mar 13, 2001·18 cites·20 claims
- 0955US8077512B2Flash memory cell and method for operating the sameRENN SHING HWA·Filed 2009·Granted Dec 13, 2011·1 cites·16 claims
- 1046US8420411B2Method for aligning wafer stackRENN SHING-HWA·Filed 2011·Granted Apr 16, 2013·0 cites·9 claims
- 1144US2011042722A1Integrated circuit structure and memory arrayNANYA TECHNOLOGY CORP·Filed 2009·Application pending·0 cites
- 1240US8587047B2Capacitor formation for a pumping circuitTING YU-WEI·Filed 2008·Granted Nov 19, 2013·0 cites·5 claims
- 1336US2011260297A1Through-substrate via and fabrication method thereofLIN SHIAN-JYH·Filed 2010·Application pending·0 cites
- 1435US2012032339A1Integrated circuit structure with through via for heat evacuatingRENN SHING HWA·Filed 2010·Application pending·0 cites
- 1534US2011298041A1Single-gate finfet and fabrication method thereofRENN SHING-HWA·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →