Inventor · disambiguated record
Chih-Yi Lai
Also filed as: LAI CHIH-YI
6 granted patents·1 pending application·123 citations·filing 1998–2011
80Inventor score
Top patents by PatentIndex Score
7 records- 0190US6871115B2Method and apparatus for monitoring the operation of a wafer handling robotTAIWAN SEMICONDUCTOR MFG·Filed 2002·Granted Mar 22, 2005·101 cites·19 claims
- 0264US6782883B2Cutting device for breaking fragile materials such as semiconductor wafers or the likeIND TECH RES INST·Filed 2003·Granted Aug 31, 2004·10 cites·20 claims
- 0347US6932259B2Brittle material breaking apparatusIND TECH RES INST·Filed 2004·Granted Aug 23, 2005·2 cites·20 claims
- 0443US6348943B1Digital non-contact blade position detection apparatusIND TECH RES INST·Filed 1998·Granted Feb 19, 2002·10 cites·16 claims
- 0535US7359763B2Cutting tool angle adjustment methodIND TECH RES INST·Filed 2004·Granted Apr 15, 2008·0 cites·7 claims
- 0631US7731318B2Pneumatic ink-jet systemDIGITAL PHOTONICS CORP·Filed 2008·Granted Jun 8, 2010·0 cites·12 claims
- 0731US2013147870A1Printing method for three-dimensional painting by uv digital printing deviceYEH AWEN·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →