Assignee

ZHENGHAI GROUP CO LTD

CN·1 granted patent·1 pending application·0 citations·filing 2021–2021

Technology mixH10W2 H01L1 H01R1 H02K1 H02M1 H05K1

Top patents by PatentIndex Score

2 records

0131US2024030090A1Heat dissipation structure of cooling plate for power semiconductor moduleZHENGHAI GROUP CO LTD·Filed 2021·Application pending·0 cites
0228US12294312B2Low stray inductance busbar structure for power moduleZHENGHAI GROUP CO LTD·Filed 2021·Granted May 6, 2025·0 cites·8 claims

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