Assignee
ZHEN DING TECHNOLOGY CO LTD
TW·19 granted patents·17 pending applications·25 citations·filing 2006–2015
Top patents by PatentIndex Score
36 records- 0179US9295150B2Method for manufacturing a printed circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Mar 22, 2016·4 cites·7 claims
- 0279US9107332B2Method for manufacturing printed circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Aug 11, 2015·4 cites·7 claims
- 0377US9271388B2Interposer and package on package structureZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 23, 2016·4 cites·13 claims
- 0476US9024203B2Embedded printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted May 5, 2015·6 cites·10 claims
- 0572US9015936B2Method for manufacturing IC substrateZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Apr 28, 2015·3 cites·13 claims
- 0668US9265146B2Method for manufacturing a multi-layer circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 16, 2016·1 cites·12 claims
- 0766US9089082B2Printed circuit board with embedded component and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Jul 21, 2015·1 cites·8 claims
- 0858US9190386B2Substrate, chip package and method for manufacturing substrateZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Nov 17, 2015·1 cites·8 claims
- 0958US8951848B2Circuit substrate for mounting chip, method for manufacturing same and chip package having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 10, 2015·1 cites·6 claims
- 1053US8647518B2Resin coated copper foil, method for manufacturing same and multi-layer circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Feb 11, 2014·0 cites·12 claims
- 1152US9159614B2Packaging substrate and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 13, 2015·0 cites·5 claims
- 1252US2016135295A1Multi-layer circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 1349US8377252B2Apparatus for spraying etchant onto printed circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2006·Granted Feb 19, 2013·0 cites·16 claims
- 1449US2014158410A1Polyimide, copper-clad laminate, flexible printed circuit board, and method for manufacturing the flexible printed circuit boardZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1549US2014158407A1Printed circuit board with visible triangular shaped tracesZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1649US2014151092A1Pcb with visible circuit and method for making and using pcb with visible circuitZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 1748US2015000959A1Multilayer printed circuit board having anisotropy condictive film and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 1846US9099450B2Package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Aug 4, 2015·0 cites·4 claims
- 1945US2014054079A1Multilayer flexible printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2044US2014144675A1Multi-layer printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2144US2014374153A1Printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 2244US2014182899A1Rigid-flexible printed circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2343US2013341073A1Packaging substrate and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2443US2014146504A1Circuit board, package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2542US9357647B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted May 31, 2016·0 cites·7 claims
- 2642US9173298B2Packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 27, 2015·0 cites·5 claims
- 2742US2014085833A1Chip packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2842US2014054785A1Chip package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 2941US2014036465A1Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
- 3036US2015380391A1Packaging substrate, method for manufacturing same, and chip packaging structure having sameZHEN DING TECHNOLOGY CO LTD·Filed 2015·Application pending·0 cites
- 3135US9362248B2Coreless package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Granted Jun 7, 2016·0 cites·16 claims
- 3235US9165790B2Packaging substrate, method for manufacturing same, and chip packaging body having sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Oct 20, 2015·0 cites·7 claims
- 3333US2014353006A1Multilayer circuit board and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Application pending·0 cites
- 3432US9332656B2Interposer and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2014·Granted May 3, 2016·0 cites·4 claims
- 3528US8941227B2Package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Granted Jan 27, 2015·0 cites·16 claims
- 3625US2014061951A1Package on package structure and method for manufacturing sameZHEN DING TECHNOLOGY CO LTD·Filed 2013·Application pending·0 cites
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