Assignee
ZHAI JUN
US·1 granted patent·2 pending applications·0 citations·filing 2011–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0143US8486767B2Interconnects with improved electromigration reliabilityZHAI JUN·Filed 2011·Granted Jul 16, 2013·0 cites·20 claims
- 0235US2014061950A1Stackable flip chip for memory packagesZHAI JUN·Filed 2012·Application pending·0 cites
- 0333US2013020702A1Double-sided flip chip packageZHAI JUN·Filed 2011·Application pending·0 cites
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