Assignee
ZENG XIANPING
CN·0 granted patents·3 pending applications·0 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0143US2015240055A1Epoxy resin compound and prepreg and copper-clad laminate manufactured using the compoundZENG XIANPING·Filed 2012·Application pending·0 cites
- 0241US2014342161A1Epoxy Resin Composition and Prepreg and Copper Clad Laminate Manufactured by Using the SameZENG XIANPING·Filed 2011·Application pending·0 cites
- 0341US2014349120A1Epoxy Resin Composition and High Frequency Circuit Board Manufactured by Using the SameZENG XIANPING·Filed 2011·Application pending·0 cites
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