Assignee
ZENG KEJUN
0 granted patents·3 pending applications·0 citations·filing 2004–2010
Top patents by PatentIndex Score
3 records- 0134US2006038302A1Thermal fatigue resistant tin-lead-silver solderZENG KEJUN·Filed 2004·Application pending·0 cites
- 0234US2005275096A1Pre-doped reflow interconnections for copper padsZENG KEJUN·Filed 2004·Application pending·0 cites
- 0328US2012001336A1Corrosion-resistant copper-to-aluminum bondsZENG KEJUN·Filed 2010·Application pending·0 cites
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