Assignee
YOSHIOKA SHINGO
JP·7 granted patents·1 pending application·69 citations·filing 2008–2012
Top patents by PatentIndex Score
8 records- 0195US8482137B2Method of mounting semiconductor chips, semiconductor device obtained using the method, method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the sameYOSHIOKA SHINGO·Filed 2010·Granted Jul 9, 2013·22 cites·21 claims
- 0290US8240036B2Method of producing a circuit boardYOSHIOKA SHINGO·Filed 2008·Granted Aug 14, 2012·19 cites·16 claims
- 0388US8929092B2Circuit board, and semiconductor device having component mounted on circuit boardYOSHIOKA SHINGO·Filed 2010·Granted Jan 6, 2015·10 cites·5 claims
- 0485US9332650B2Method of producing multilayer circuit boardYOSHIOKA SHINGO·Filed 2012·Granted May 3, 2016·7 cites·10 claims
- 0576US8272126B2Method of producing circuit boardYOSHIOKA SHINGO·Filed 2009·Granted Sep 25, 2012·6 cites·12 claims
- 0671US8698003B2Method of producing circuit board, and circuit board obtained using the manufacturing methodYOSHIOKA SHINGO·Filed 2009·Granted Apr 15, 2014·4 cites·20 claims
- 0761US9082635B2Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module and multilayer circuit boardYOSHIOKA SHINGO·Filed 2011·Granted Jul 14, 2015·1 cites·9 claims
- 0848US2012292083A1Method of producing circuit board by additive method, and circuit board and multilayer circuit board obtained by the methodYOSHIOKA SHINGO·Filed 2012·Application pending·0 cites
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