Assignee
YMT CO LTD
KR·8 granted patents·7 pending applications·6 citations·filing 2006–2023
Top patents by PatentIndex Score
15 records- 0187US9758889B2Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured therebyYMT CO LTD·Filed 2014·Granted Sep 12, 2017·5 cites·7 claims
- 0273US12495494B2Metal foil, carrier with metal foil comprising the same and printed circuit board including the sameYMT CO LTD·Filed 2021·Granted Dec 9, 2025·1 cites·7 claims
- 0370US12534426B2Leveler and electroplating composition for filling via holeYMT CO LTD·Filed 2023·Granted Jan 27, 2026·0 cites·5 claims
- 0458US2024174812A1Leveling agent and electroplating composition for forming circuit pattern including the sameYMT CO LTD·Filed 2022·Application pending·0 cites
- 0557US2025031316A1Methods for forming circuit pattern on substrate using metal foil with low surface roughnessYMT CO LTD·Filed 2023·Application pending·0 cites
- 0655US12408279B2Release layer for metal foil with carrier and metal foil comprising the sameYMT CO LTD·Filed 2021·Granted Sep 2, 2025·0 cites·8 claims
- 0750US11499233B2Plated laminate and printed circuit boardYMT CO LTD·Filed 2019·Granted Nov 15, 2022·0 cites·6 claims
- 0849US12139811B2Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the sameYMT CO LTD·Filed 2020·Granted Nov 12, 2024·0 cites·3 claims
- 0949US11028495B2Method for producing porous copper foil and porous copper foil produced by the sameYMT CO LTD·Filed 2018·Granted Jun 8, 2021·0 cites·3 claims
- 1048US2014098504A1Electroplating method for printed circuit boardYMT CO LTD·Filed 2012·Application pending·0 cites
- 1148US2024133039A1Leveling agent and electrolytic composition for filling via holeYMT CO LTD·Filed 2022·Application pending·0 cites
- 1245US12522559B2Leveling agent and electrolytic composition for filling via holeYMT CO LTD·Filed 2022·Granted Jan 13, 2026·0 cites·8 claims
- 1344US2023203693A1Surface modifier for electrolytic nickel plating and nickel electroplating solution including the sameYMT CO LTD·Filed 2021·Application pending·0 cites
- 1441US2024260200A1Metal foil with carrier foil, laminate for printed wiring board using same, and manufacturing method for laminateYMT CO LTD·Filed 2022·Application pending·0 cites
- 1540US2007104929A1Method for plating printed circuit board and printed circuit board manufactured therefromYMT CO LTD·Filed 2006·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →