Assignee
YKC KK
JP·3 granted patents·13 citations·filing 1990–1993
Top patents by PatentIndex Score
3 records- 0138US5027866AForming press for semiconductor package leadsYKC KK·Filed 1990·Granted Jul 2, 1991·10 cites·9 claims
- 0229US5048412AApparatus for processing semiconductor packages and the likeYKC KK·Filed 1990·Granted Sep 17, 1991·2 cites·6 claims
- 0310US5358017AMethod, system and apparatus for forming leads for semiconductors packagesYKC KK·Filed 1993·Granted Oct 25, 1994·1 cites·5 claims
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