Assignee
YIM CHOONGBIN
KR·3 granted patents·60 citations·filing 2010–2014
Top patents by PatentIndex Score
3 records- 0195US8779606B2Package-on-package electronic devices including sealing layers and related methods of forming the sameYIM CHOONGBIN·Filed 2013·Granted Jul 15, 2014·55 cites·18 claims
- 0277US9245867B2Package-on-package electronic devices including sealing layers and related methods of forming the sameYIM CHOONGBIN·Filed 2014·Granted Jan 26, 2016·4 cites·11 claims
- 0357US8569114B2Method of forming a semiconductor device packageYIM CHOONGBIN·Filed 2010·Granted Oct 29, 2013·1 cites·18 claims
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