Assignee
YEW MING-CHIH
TW·3 granted patents·51 citations·filing 2011–2012
Top patents by PatentIndex Score
3 records- 0195US8624392B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 7, 2014·34 cites·20 claims
- 0289US8847369B2Packaging structures and methods for semiconductor devicesYEW MING-CHIH·Filed 2012·Granted Sep 30, 2014·12 cites·20 claims
- 0377US9548281B2Electrical connection for chip scale packagingYEW MING-CHIH·Filed 2011·Granted Jan 17, 2017·5 cites·20 claims
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