Assignee
YEN YU-LIN
TW·11 granted patents·67 citations·filing 2006–2012
Top patents by PatentIndex Score
11 records- 0195US8692382B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 8, 2014·23 cites·25 claims
- 0294US8525345B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Sep 3, 2013·21 cites·18 claims
- 0377US9559001B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Jan 31, 2017·5 cites·21 claims
- 0477US8698316B2Chip packageYEN YU-LIN·Filed 2011·Granted Apr 15, 2014·3 cites·26 claims
- 0576US8581386B2Chip packageYEN YU-LIN·Filed 2012·Granted Nov 12, 2013·4 cites·20 claims
- 0674US9136241B2Chip package and manufacturing method thereofYEN YU-LIN·Filed 2012·Granted Sep 15, 2015·4 cites·24 claims
- 0773US8552565B2Chip package and method for forming the sameYEN YU-LIN·Filed 2011·Granted Oct 8, 2013·3 cites·17 claims
- 0867US9024437B2Chip package and method for forming the sameYEN YU-LIN·Filed 2012·Granted May 5, 2015·2 cites·19 claims
- 0962US8003442B2Integrated cirucit package and method for fabrication thereofYEN YU-LIN·Filed 2007·Granted Aug 23, 2011·2 cites·13 claims
- 1046US8624383B2Integrated circuit package and method for fabrication thereofYEN YU-LIN·Filed 2010·Granted Jan 7, 2014·0 cites·20 claims
- 1145US8415088B2Method for forming a material layerYEN YU-LIN·Filed 2006·Granted Apr 9, 2013·0 cites·12 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →