Assignee
YEN LEE-SHENG
TW·6 granted patents·3 pending applications·4 citations·filing 2010–2014
Top patents by PatentIndex Score
9 records- 0168US8748234B2Method for making circuit boardYEN LEE-SHENG·Filed 2012·Granted Jun 10, 2014·2 cites·7 claims
- 0258US8698008B2Packaging substrate and fabrication method thereofYEN LEE-SHENG·Filed 2011·Granted Apr 15, 2014·1 cites·4 claims
- 0352US8628636B2Method of manufacturing a package substrateYEN LEE-SHENG·Filed 2012·Granted Jan 14, 2014·1 cites·10 claims
- 0449US8742567B2Circuit board structure and packaging structure comprising the circuit board structureYEN LEE-SHENG·Filed 2012·Granted Jun 3, 2014·0 cites·4 claims
- 0546US8836108B2Circuit board structure and package structureYEN LEE-SHENG·Filed 2010·Granted Sep 16, 2014·0 cites·4 claims
- 0640US8102063B2Pad structure with a nano-structured coating filmYEN LEE-SHENG·Filed 2010·Granted Jan 24, 2012·0 cites·27 claims
- 0740US2015171296A1Light emitting package and carrier structure thereforYEN LEE-SHENG·Filed 2014·Application pending·0 cites
- 0839US2015147535A1LaminateYEN LEE-SHENG·Filed 2013·Application pending·0 cites
- 0933US2011260340A1Circuit board structure, packaging structure and method for making the sameYEN LEE-SHENG·Filed 2010·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →