Assignee
YEH YUN-CHAO
0 granted patents·4 pending applications·0 citations·filing 2009–2013
Top patents by PatentIndex Score
4 records- 0152US2011077337A1Method for preparing a high thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layersYEH YUN-CHAO·Filed 2009·Application pending·0 cites
- 0252US2011073798A1High thermal conductivity and low dissipation factor adhesive varnish for build-up additional insulation layersYEH YUN-CHAO·Filed 2009·Application pending·0 cites
- 0342US2013251469A1Double-sided metal of drilling entry boardYEH YUN-CHAO·Filed 2012·Application pending·0 cites
- 0420US2014262450A1Multilayer Printed Circuit Board StructureYEH YUN-CHAO·Filed 2013·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when YEH YUN-CHAO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →