Assignee
YAO MINGGAO
CN·11 granted patents·2 pending applications·124 citations·filing 2007–2011
Top patents by PatentIndex Score
13 records- 0196US8194359B2Piezoelectric element having etched portion to form stepped recesses between layers and manufacturing method thereof, head gimbal assembly, and disk drive device with the sameYAO MINGGAO·Filed 2008·Granted Jun 5, 2012·40 cites·11 claims
- 0296US8089728B2Head gimbal assembly, suspension for the head gimbal assembly, and disk drive unit with the sameYAO MINGGAO·Filed 2009·Granted Jan 3, 2012·38 cites·24 claims
- 0391US8169745B2Head gimbal assembly having balanced weight, and disk drive unit with the sameYAO MINGGAO·Filed 2007·Granted May 1, 2012·14 cites·14 claims
- 0490US8130469B2Suspension, head gimbal assembly and/or disk drive unit including outrigger with spring beams, and/or manufacturing method thereofYAO MINGGAO·Filed 2007·Granted Mar 6, 2012·11 cites·18 claims
- 0587US8089732B2Thin film piezoelectric element and its manufacturing method, head gimbal assembly and disk drive unit with the sameYAO MINGGAO·Filed 2008·Granted Jan 3, 2012·7 cites·18 claims
- 0686US8134809B2Disk drive head gimbal assembly including a PZT micro-actuator with a pair of separate PZT elementsYAO MINGGAO·Filed 2008·Granted Mar 13, 2012·7 cites·16 claims
- 0773US8120881B2Head gimbal assembly and manufacturing method thereof, and disk drive device with the sameYAO MINGGAO·Filed 2008·Granted Feb 21, 2012·2 cites·18 claims
- 0870US8125735B2Vibration sensor, suspension, head gimbal assembly and manufacturing method thereof, and disk drive unit including the sameYAO MINGGAO·Filed 2009·Granted Feb 28, 2012·1 cites·24 claims
- 0968US8225655B2Altitude sensing systems for flying height adjustmentYAO MINGGAO·Filed 2007·Granted Jul 24, 2012·1 cites·23 claims
- 1061US2008273272A1Micro-Actuator, HGA Equipped with the Micro-Actuator and Method for Manufacturing the HGAYAO MINGGAO·Filed 2008·Application pending·0 cites
- 1160US8261458B2Geomagnetic sensor device and digital compass with the sameYAO MINGGAO·Filed 2011·Granted Sep 11, 2012·3 cites·12 claims
- 1253US8472142B2Method of making a bonded structure for an electrical component, and/or head gimbal assembly, head stack assembly, and disk drive unit incorporating the sameYAO MINGGAO·Filed 2007·Granted Jun 25, 2013·0 cites·18 claims
- 1348US2010214697A1Suspension design for high shock performance soldering ball bondingYAO MINGGAO·Filed 2007·Application pending·0 cites
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