Assignee
YANG YU-JU
TW·0 granted patents·3 pending applications·0 citations·filing 2011–2012
Technology mixH10W3
Top patents by PatentIndex Score
3 records- 0147US2012292761A1Bonding pad structure and integrated circuit comprising a plurality of bonding pad structuresYANG YU-JU·Filed 2012·Application pending·0 cites
- 0247US2012299180A1Bonding pad structure and integrated circuit comprising a plurality of bonding pad structuresYANG YU-JU·Filed 2012·Application pending·0 cites
- 0344US2012146215A1Bonding pad structure and integrated circuit comprising a plurality of bonding pad structuresYANG YU-JU·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →