Assignee
YANG CHUNG-YING
TW·4 granted patents·35 citations·filing 2010–2011
Top patents by PatentIndex Score
4 records- 0191US8217394B2Probe pad on a corner stress relief region in a semiconductor chipYANG CHUNG-YING·Filed 2011·Granted Jul 10, 2012·16 cites·20 claims
- 0287US8624359B2Wafer level chip scale package and method of manufacturing the sameYANG CHUNG-YING·Filed 2011·Granted Jan 7, 2014·7 cites·22 claims
- 0386US8669651B2Package-on-package structures with reduced bump bridgingYANG CHUNG-YING·Filed 2010·Granted Mar 11, 2014·9 cites·15 claims
- 0476US8796686B2Integrated circuits with leakage current test structureYANG CHUNG-YING·Filed 2011·Granted Aug 5, 2014·3 cites·20 claims
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