Assignee
YANG CHIH-CHAO
US·47 granted patents·6 pending applications·581 citations·filing 2005–2012
Top patents by PatentIndex Score
53 records- 0199US8482132B2Pad bonding employing a self-aligned plated liner for adhesion enhancementYANG CHIH-CHAO·Filed 2009·Granted Jul 9, 2013·237 cites·6 claims
- 0297US8420531B2Enhanced diffusion barrier for interconnect structuresYANG CHIH-CHAO·Filed 2011·Granted Apr 16, 2013·29 cites·20 claims
- 0395US8232196B2Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for BEOL integrationYANG CHIH-CHAO·Filed 2009·Granted Jul 31, 2012·31 cites·14 claims
- 0494US8664766B2Interconnect structure containing non-damaged dielectric and a via gouging featureYANG CHIH-CHAO·Filed 2009·Granted Mar 4, 2014·23 cites·18 claims
- 0594US8530320B2High-nitrogen content metal resistor and method of forming sameYANG CHIH-CHAO·Filed 2011·Granted Sep 10, 2013·15 cites·14 claims
- 0694US8525339B2Hybrid copper interconnect structure and method of fabricating sameYANG CHIH-CHAO·Filed 2011·Granted Sep 3, 2013·16 cites·16 claims
- 0794US8242600B2Redundant metal barrier structure for interconnect applicationsYANG CHIH-CHAO·Filed 2009·Granted Aug 14, 2012·26 cites·19 claims
- 0894US8138604B2Metal cap with ultra-low k dielectric material for circuit interconnect applicationsYANG CHIH-CHAO·Filed 2007·Granted Mar 20, 2012·27 cites·16 claims
- 0993US8796853B2Metallic capped interconnect structure with high electromigration resistance and low resistivityYANG CHIH-CHAO·Filed 2012·Granted Aug 5, 2014·17 cites·15 claims
- 1093US8405135B23D via capacitor with a floating conductive plate for improved reliabilityYANG CHIH-CHAO·Filed 2010·Granted Mar 26, 2013·14 cites·16 claims
- 1192US8835305B2Method of fabricating a profile control in interconnect structuresYANG CHIH-CHAO·Filed 2012·Granted Sep 16, 2014·12 cites·13 claims
- 1291US8492265B2Pad bonding employing a self-aligned plated liner for adhesion enhancementYANG CHIH-CHAO·Filed 2012·Granted Jul 23, 2013·11 cites·20 claims
- 1389US8133767B2Efficient interconnect structure for electrical fuse applicationsYANG CHIH-CHAO·Filed 2010·Granted Mar 13, 2012·9 cites·8 claims
- 1488US8659156B2Interconnect structure with an electromigration and stress migration enhancement linerYANG CHIH-CHAO·Filed 2011·Granted Feb 25, 2014·8 cites·19 claims
- 1586US8133810B2Structure for metal cap applicationsYANG CHIH-CHAO·Filed 2010·Granted Mar 13, 2012·7 cites·17 claims
- 1685US8232645B2Interconnect structures, design structure and method of manufactureYANG CHIH-CHAO·Filed 2008·Granted Jul 31, 2012·9 cites·14 claims
- 1785US8138083B2Interconnect structure having enhanced electromigration reliability and a method of fabricating sameYANG CHIH-CHAO·Filed 2009·Granted Mar 20, 2012·10 cites·25 claims
- 1884US8288276B2Method of forming an interconnect structure including a metallic interfacial layer located at a bottom via portionYANG CHIH-CHAO·Filed 2008·Granted Oct 16, 2012·10 cites·16 claims
- 1984US8159042B2Adopting feature of buried electrically conductive layer in dielectrics for electrical anti-fuse applicationYANG CHIH-CHAO·Filed 2008·Granted Apr 17, 2012·9 cites·22 claims
- 2083US8592306B2Redundant metal barrier structure for interconnect applicationsYANG CHIH-CHAO·Filed 2012·Granted Nov 26, 2013·5 cites·18 claims
- 2182US8957519B2Structure and metallization process for advanced technology nodesYANG CHIH-CHAO·Filed 2010·Granted Feb 17, 2015·5 cites·14 claims
- 2280US8169077B2Dielectric interconnect structures and methods for forming the sameYANG CHIH-CHAO·Filed 2008·Granted May 1, 2012·6 cites·7 claims
- 2379US8564132B2Tungsten metallization: structure and fabrication of sameYANG CHIH-CHAO·Filed 2011·Granted Oct 22, 2013·4 cites·10 claims
- 2479US8232647B2Structure and process for metallization in high aspect ratio featuresYANG CHIH-CHAO·Filed 2008·Granted Jul 31, 2012·6 cites·7 claims
- 2578US8610276B2Metal cap for back end of line (BEOL) interconnects, design structure and method of manufactureYANG CHIH-CHAO·Filed 2012·Granted Dec 17, 2013·3 cites·11 claims
- 2675US8456006B2Hybrid interconnect structure for performance improvement and reliability enhancementYANG CHIH-CHAO·Filed 2011·Granted Jun 4, 2013·2 cites·20 claims
- 2774US8679970B2Structure and process for conductive contact integrationYANG CHIH-CHAO·Filed 2008·Granted Mar 25, 2014·6 cites·11 claims
- 2873US8952486B2Electrical fuse and method of making the sameYANG CHIH-CHAO·Filed 2011·Granted Feb 10, 2015·4 cites·38 claims
- 2972US8753927B2Low cost anti-fuse structure and method to make sameYANG CHIH-CHAO·Filed 2012·Granted Jun 17, 2014·2 cites·17 claims
- 3072US8492871B2Electrical fuse and method of makingYANG CHIH-CHAO·Filed 2008·Granted Jul 23, 2013·3 cites·15 claims
- 3170US9245794B2Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect applicationYANG CHIH-CHAO·Filed 2012·Granted Jan 26, 2016·2 cites·17 claims
- 3269US8405215B2Interconnect structure and method for Cu/ultra low k integrationYANG CHIH-CHAO·Filed 2010·Granted Mar 26, 2013·2 cites·20 claims
- 3368US8232195B2Method for fabricating back end of the line structures with liner and seed materialsYANG CHIH-CHAO·Filed 2008·Granted Jul 31, 2012·3 cites·12 claims
- 3466US8823176B2Discontinuous/non-uniform metal cap structure and process for interconnect integrationYANG CHIH-CHAO·Filed 2008·Granted Sep 2, 2014·2 cites·19 claims
- 3565US8450204B2Structure and process for metallization in high aspect ratio featuresYANG CHIH-CHAO·Filed 2012·Granted May 28, 2013·1 cites·15 claims
- 3665US8129842B2Enhanced interconnect structureYANG CHIH-CHAO·Filed 2009·Granted Mar 6, 2012·2 cites·10 claims
- 3763US8877645B2Integrated circuit structure having selectively formed metal capYANG CHIH-CHAO·Filed 2011·Granted Nov 4, 2014·1 cites·10 claims
- 3863US8609534B2Electrical fuse structure and method of fabricating sameYANG CHIH-CHAO·Filed 2010·Granted Dec 17, 2013·1 cites·14 claims
- 3960US8336204B2Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect applicationYANG CHIH-CHAO·Filed 2009·Granted Dec 25, 2012·1 cites·19 claims
- 4055US8105936B2Methods for forming dielectric interconnect structuresYANG CHIH-CHAO·Filed 2008·Granted Jan 31, 2012·0 cites·12 claims
- 4154US8563419B2Method of manufacturing an interconnect structure and design structure thereofYANG CHIH-CHAO·Filed 2012·Granted Oct 22, 2013·0 cites·15 claims
- 4253US8637957B1Low cost anti-fuse structureYANG CHIH-CHAO·Filed 2012·Granted Jan 28, 2014·0 cites·17 claims
- 4350US8889546B2Discontinuous/non-uniform metal cap structure and process for interconnect integrationYANG CHIH-CHAO·Filed 2012·Granted Nov 18, 2014·0 cites·15 claims
- 4450US8802563B2Surface repair structure and process for interconnect applicationsYANG CHIH-CHAO·Filed 2012·Granted Aug 12, 2014·0 cites·16 claims
- 4550US8497580B2Noble metal cap for interconnect structuresYANG CHIH-CHAO·Filed 2011·Granted Jul 30, 2013·0 cites·20 claims
- 4649US8669182B2Metal cap with ultra-low κ dielectric material for circuit interconnect applicationsYANG CHIH-CHAO·Filed 2012·Granted Mar 11, 2014·0 cites·17 claims
- 4749US2012199976A1Interconnect structure having a via with a via gouging feature and dielectric liner sidewalls for beol integrationYANG CHIH-CHAO·Filed 2012·Application pending·0 cites
- 4847US2007117377A1Conductor-dielectric structure and method for fabricatingYANG CHIH-CHAO·Filed 2005·Application pending·0 cites
- 4945US2011293742A1Antibacterial alloy coating compositionYANG CHIH CHAO·Filed 2010·Application pending·0 cites
- 5044US8642460B2Semiconductor switching device and method of making the sameYANG CHIH-CHAO·Filed 2011·Granted Feb 4, 2014·0 cites·16 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when YANG CHIH-CHAO files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →