Assignee
YAMADA ERINA
JP·3 granted patents·1 pending application·8 citations·filing 2011–2012
Top patents by PatentIndex Score
4 records- 0173US8580066B2Method for manufacturing multilayer wiring substrateYAMADA ERINA·Filed 2012·Granted Nov 12, 2013·5 cites·4 claims
- 0267US8785786B2Wiring board and method of manufacturing the sameYAMADA ERINA·Filed 2011·Granted Jul 22, 2014·3 cites·5 claims
- 0338US8809692B2Wiring boardYAMADA ERINA·Filed 2011·Granted Aug 19, 2014·0 cites·6 claims
- 0434US2012152598A1Wiring board and method of manufacturing the sameYAMADA ERINA·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →