Assignee
Xiao jun-yi
CN·1 granted patent·4 pending applications·0 citations·filing 2011–2011
Top patents by PatentIndex Score
5 records- 0144US8625297B2Package structure with electronic component and method for manufacturing sameXiao jun-yi·Filed 2011·Granted Jan 7, 2014·0 cites·11 claims
- 0238US2013063864A1Multi-layer ceramic electronic component with solder blocking layerXiao jun-yi·Filed 2011·Application pending·0 cites
- 0334US2013071505A1Molding device for semiconductor chip packageXiao jun-yi·Filed 2011·Application pending·0 cites
- 0434US2013048351A1Electronic package structure and method for manufacturing sameXiao jun-yi·Filed 2011·Application pending·0 cites
- 0533US2012279771A1Package structure with electronic component and method for manufacturing sameXiao jun-yi·Filed 2011·Application pending·0 cites
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