Assignee
XIANGNENG HUALEI OPTOELECTRONIC CO LTD
CN·2 granted patents·31 citations·filing 2016–2016
Top patents by PatentIndex Score
2 records- 0188US10147849B2Manufacturing method of flip-chip structure of group III semiconductor light emitting deviceXIANGNENG HUALEI OPTOELECTRONIC CO LTD·Filed 2016·Granted Dec 4, 2018·31 cites·14 claims
- 0224US9893040B2Flip-chip structure of group III semiconductor light emitting deviceXIANGNENG HUALEI OPTOELECTRONIC CO LTD·Filed 2016·Granted Feb 13, 2018·0 cites·13 claims
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