Assignee
XCELSIS CORP
US·42 granted patents·5 pending applications·1,416 citations·filing 2016–2022
Top patents by PatentIndex Score
47 records- 0199US11348898B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2020·Granted May 31, 2022·144 cites·17 claims
- 0299US11176450B2Three dimensional circuit implementing machine trained networkXCELSIS CORP·Filed 2017·Granted Nov 16, 2021·144 cites·26 claims
- 0399US10991804B2Transistor level interconnection methodologies utilizing 3D interconnectsXCELSIS CORP·Filed 2019·Granted Apr 27, 2021·144 cites·10 claims
- 0499US10950547B2Stacked IC structure with system level wiring on multiple sides of the IC dieXCELSIS CORP·Filed 2020·Granted Mar 16, 2021·145 cites·19 claims
- 0599US10886177B23D chip with shared clock distribution networkXCELSIS CORP·Filed 2020·Granted Jan 5, 2021·148 cites·20 claims
- 0699US10762420B2Self repairing neural networkXCELSIS CORP·Filed 2017·Granted Sep 1, 2020·30 cites·16 claims
- 0799US10672663B23D chip sharing power circuitXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·25 cites·24 claims
- 0899US10580757B2Face-to-face mounted IC dies with orthogonal top interconnect layersXCELSIS CORP·Filed 2018·Granted Mar 3, 2020·25 cites·20 claims
- 0998US11127738B2Back biasing of FD-SOI circuit blocksXCELSIS CORP·Filed 2018·Granted Sep 21, 2021·144 cites·18 claims
- 1098US10923413B2Hard IP blocks with physically bidirectional passagewaysXCELSIS CORP·Filed 2019·Granted Feb 16, 2021·144 cites·18 claims
- 1198US10719762B2Three dimensional chip structure implementing machine trained networkXCELSIS CORP·Filed 2017·Granted Jul 21, 2020·20 cites·21 claims
- 1298US10672744B23D compute circuit with high density Z-axis interconnectsXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·27 cites·20 claims
- 1398US10672745B23D processorXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·25 cites·20 claims
- 1498US10672743B23D Compute circuit with high density z-axis interconnectsXCELSIS CORP·Filed 2018·Granted Jun 2, 2020·23 cites·23 claims
- 1598US10607136B2Time borrowing between layers of a three dimensional chip stackXCELSIS CORP·Filed 2017·Granted Mar 31, 2020·21 cites·22 claims
- 1698US10600691B23D chip sharing power interconnect layerXCELSIS CORP·Filed 2018·Granted Mar 24, 2020·24 cites·24 claims
- 1798US10600735B23D chip sharing data busXCELSIS CORP·Filed 2018·Granted Mar 24, 2020·21 cites·21 claims
- 1898US10586786B23D chip sharing clock interconnect layerXCELSIS CORP·Filed 2018·Granted Mar 10, 2020·22 cites·24 claims
- 1998US10580735B2Stacked IC structure with system level wiring on multiple sides of the IC dieXCELSIS CORP·Filed 2018·Granted Mar 3, 2020·21 cites·20 claims
- 2098US10522352B2Direct-bonded native interconnects and active base dieXCELSIS CORP·Filed 2017·Granted Dec 31, 2019·20 cites·23 claims
- 2197US11152336B23D processor having stacked integrated circuit dieXCELSIS CORP·Filed 2020·Granted Oct 19, 2021·4 cites·21 claims
- 2297US10910344B2Systems and methods for releveled bump planes for chipletsXCELSIS CORP·Filed 2018·Granted Feb 2, 2021·17 cites·5 claims
- 2397US10600780B23D chip sharing data bus circuitXCELSIS CORP·Filed 2018·Granted Mar 24, 2020·21 cites·24 claims
- 2497US10593667B23D chip with shielded clock linesXCELSIS CORP·Filed 2018·Granted Mar 17, 2020·22 cites·20 claims
- 2596US11404439B23D NAND—high aspect ratio strings and channelsXCELSIS CORP·Filed 2020·Granted Aug 2, 2022·3 cites·10 claims
- 2696US10832912B2Direct-bonded native interconnects and active base dieXCELSIS CORP·Filed 2019·Granted Nov 10, 2020·10 cites·20 claims
- 2794US10784282B23D NAND—high aspect ratio strings and channelsXCELSIS CORP·Filed 2019·Granted Sep 22, 2020·6 cites·21 claims
- 2892US10700094B2Device disaggregation for improved performanceXCELSIS CORP·Filed 2018·Granted Jun 30, 2020·6 cites·25 claims
- 2989US10978348B23D chip sharing power interconnect layerXCELSIS CORP·Filed 2020·Granted Apr 13, 2021·2 cites·20 claims
- 3085US11289333B2Direct-bonded native interconnects and active base dieXCELSIS CORP·Filed 2020·Granted Mar 29, 2022·1 cites·26 claims
- 3179US11469214B2Stacked architecture for three-dimensional NANDXCELSIS CORP·Filed 2019·Granted Oct 11, 2022·2 cites·20 claims
- 3276US11139283B2Abstracted NAND logic in stacksXCELSIS CORP·Filed 2019·Granted Oct 5, 2021·2 cites·23 claims
- 3374US10970627B2Time borrowing between layers of a three dimensional chip stackXCELSIS CORP·Filed 2020·Granted Apr 6, 2021·0 cites·20 claims
- 3472US10892252B2Face-to-face mounted IC dies with orthogonal top interconnect layersXCELSIS CORP·Filed 2020·Granted Jan 12, 2021·0 cites·22 claims
- 3571US10852545B2Head mounted viewer for AR and VR scenesXCELSIS CORP·Filed 2018·Granted Dec 1, 2020·1 cites·15 claims
- 3671US10295588B2Wafer testing without direct probingXCELSIS CORP·Filed 2016·Granted May 21, 2019·1 cites·8 claims
- 3767US10734759B2Configurable smart object system with magnetic contacts and magnetic assemblyXCELSIS CORP·Filed 2019·Granted Aug 4, 2020·1 cites·20 claims
- 3866US2023050150A1Stacked architecture for three-dimensional nandXCELSIS CORP·Filed 2022·Application pending·0 cites
- 3965US11157670B2Systems and methods for inter-die block level designXCELSIS CORP·Filed 2020·Granted Oct 26, 2021·0 cites·18 claims
- 4062US2022020741A1Back Biasing of FD-SOI Circuit BlockXCELSIS CORP·Filed 2021·Application pending·0 cites
- 4160US10664564B2Systems and methods for inter-die block level designXCELSIS CORP·Filed 2018·Granted May 26, 2020·0 cites·18 claims
- 4254US11239587B2Configurable smart object system with clip-based connectorsXCELSIS CORP·Filed 2019·Granted Feb 1, 2022·0 cites·19 claims
- 4351US11246230B2Configurable smart object system with methods of making modules and contactorsXCELSIS CORP·Filed 2018·Granted Feb 8, 2022·0 cites·12 claims
- 4446US10684929B2Self healing compute arrayXCELSIS CORP·Filed 2017·Granted Jun 16, 2020·0 cites·18 claims
- 4544US2019280421A1Configurable smart object system with grid or frame-based connectorsXCELSIS CORP·Filed 2019·Application pending·0 cites
- 4642US2019097362A1Configurable smart object system with standard connectors for adding artificial intelligence to appliances, vehicles, and devicesXCELSIS CORP·Filed 2018·Application pending·0 cites
- 4740US2019393204A1Eliminating defects in stacksXCELSIS CORP·Filed 2018·Application pending·0 cites
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