Assignee
WU WEI-CHENG
TW·5 granted patents·1,108 citations·filing 2010–2012
Top patents by PatentIndex Score
5 records- 0198US9048233B2Package systems having interposersWU WEI-CHENG·Filed 2010·Granted Jun 2, 2015·1.1k cites·19 claims
- 0297US8797057B2Testing of semiconductor chips with microbumpsWU WEI-CHENG·Filed 2011·Granted Aug 5, 2014·17 cites·20 claims
- 0396US8283781B2Semiconductor device having pad structure with stress buffer layerWU WEI-CHENG·Filed 2010·Granted Oct 9, 2012·33 cites·20 claims
- 0473US9000533B2Device and methods for high-K and metal gate stacksWU WEI CHENG·Filed 2012·Granted Apr 7, 2015·3 cites·8 claims
- 0545US9392266B2Three-dimensional display deviceWU WEI-CHENG·Filed 2012·Granted Jul 12, 2016·0 cites·19 claims
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