Assignee
WU SHIN-HSIEN
0 granted patents·2 pending applications·0 citations·filing 2004–2006
Technology mixH05K2
Top patents by PatentIndex Score
2 records- 0117US2006213686A1Cut Via Structure For And Manufacturing Method Of Connecting Separate ConductorsWU SHIN-HSIEN·Filed 2006·Application pending·0 cites
- 0213US2006082984A1Cut via structure for and manufacturing method of connecting separate conductorsWU SHIN-HSIEN·Filed 2004·Application pending·0 cites
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