Assignee
WU PING-CHANG
TW·2 granted patents·12 pending applications·5 citations·filing 2005–2011
Top patents by PatentIndex Score
14 records- 0172US8610252B2Scribe line structure for wafer dicingWU PING-CHANG·Filed 2011·Granted Dec 17, 2013·2 cites·10 claims
- 0263US8115320B2Bond pad structure located over active circuit structureWU PING-CHANG·Filed 2008·Granted Feb 14, 2012·3 cites·26 claims
- 0348US2007269961A1Semiconductor wafer and method for making the sameWU PING-CHANG·Filed 2007·Application pending·0 cites
- 0444US2008122105A1Structure for preventing pad peeling and method of fabricating the sameWU PING-CHANG·Filed 2006·Application pending·0 cites
- 0543US2008142606A1E-fuse bar code structure and method of using the sameWU PING-CHANG·Filed 2006·Application pending·0 cites
- 0643US2007108549A1Semiconductor structureWU PING-CHANG·Filed 2005·Application pending·0 cites
- 0741US2009033346A1Group probing over active area pads arrangementWU PING-CHANG·Filed 2007·Application pending·0 cites
- 0840US2008237854A1Method for forming contact padsWU PING-CHANG·Filed 2007·Application pending·0 cites
- 0940US2008246144A1Method for fabricating contact padsWU PING-CHANG·Filed 2007·Application pending·0 cites
- 1039US2007235872A1Semiconductor package structureWU PING-CHANG·Filed 2006·Application pending·0 cites
- 1139US2007102792A1Multi-layer crack stop structureWU PING-CHANG·Filed 2006·Application pending·0 cites
- 1238US2007210415A1Anti-fuse and programming method of the sameWU PING-CHANG·Filed 2006·Application pending·0 cites
- 1338US2007102791A1Structure of multi-layer crack stop ring and wafer having the sameWU PING-CHANG·Filed 2005·Application pending·0 cites
- 1436US2013009656A1Test pad structure on waferWU PING-CHANG·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →