Assignee
WEI JEN-CHIEH
US·2 granted patents·5 citations·filing 2010–2010
Top patents by PatentIndex Score
2 records- 0178US9345149B2Methods of treating copper surfaces for enhancing adhesion to organic substrates for use in printed circuit boardsWEI JEN-CHIEH·Filed 2010·Granted May 17, 2016·4 cites·22 claims
- 0274US9763336B2Methods of treating metal surfaces and devices formed therebyWEI JEN-CHIEH·Filed 2010·Granted Sep 12, 2017·1 cites·20 claims
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