Assignee
WATANABE ITSUO
JP·4 granted patents·1 pending application·0 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0154US8252419B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Aug 28, 2012·0 cites·6 claims
- 0254US2009314533A1Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2009·Application pending·0 cites
- 0352US8142605B2Circuit-connecting material and circuit terminal connected structure and connecting methodWATANABE ITSUO·Filed 2011·Granted Mar 27, 2012·0 cites·27 claims
- 0450US8273458B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
- 0550US8273457B2Adhesive for bonding circuit members, circuit board and process for its productionWATANABE ITSUO·Filed 2011·Granted Sep 25, 2012·0 cites·6 claims
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