Assignee
WANG YONGQIAN
0 granted patents·3 pending applications·0 citations·filing 2004–2005
Top patents by PatentIndex Score
3 records- 0139US2007001301A1Under bump metallization design to reduce dielectric layer delaminationWANG YONGQIAN·Filed 2005·Application pending·0 cites
- 0239US2006284313A1Low stress chip attachment with shape memory materialsWANG YONGQIAN·Filed 2005·Application pending·0 cites
- 0337US2005285116A1Electronic assembly with carbon nanotube contact formations or interconnectionsWANG YONGQIAN·Filed 2004·Application pending·0 cites
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