Assignee
WANG JIUNHENG
0 granted patents·3 pending applications·0 citations·filing 2005–2007
Top patents by PatentIndex Score
3 records- 0138US2007228406A1Chip package structure and method for manufacturing bumpsWANG JIUNHENG·Filed 2007·Application pending·0 cites
- 0236US2007048997A1Chip package structure and method for manufacturing bumpsWANG JIUNHENG·Filed 2005·Application pending·0 cites
- 0329US2007057998A1Nozzle plate and manufacturing process thereofWANG JIUNHENG·Filed 2006·Application pending·0 cites
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