Assignee
WALSIN ADVANCED ELECTRONICS
US·15 granted patents·7 pending applications·1,200 citations·filing 1999–2002
Top patents by PatentIndex Score
22 records- 0194US6337510B1Stackable QFN semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Jan 8, 2002·353 cites·4 claims
- 0293US6459148B1QFN semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Oct 1, 2002·214 cites·7 claims
- 0393US6437429B1Semiconductor package with metal padsWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Aug 20, 2002·257 cites·12 claims
- 0487US6385049B1Multi-board BGA packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted May 7, 2002·107 cites·13 claims
- 0581US6521485B2Method for manufacturing wafer level chip size packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Feb 18, 2003·50 cites·6 claims
- 0681US6380624B1Stacked integrated circuit structureWALSIN ADVANCED ELECTRONICS·Filed 2000·Granted Apr 30, 2002·36 cites·17 claims
- 0780US6762118B2Package having array of metal pegs linked by printed circuit linesWALSIN ADVANCED ELECTRONICS·Filed 2002·Granted Jul 13, 2004·32 cites·13 claims
- 0872US6278182B1Lead frame type semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Aug 21, 2001·40 cites·15 claims
- 0968US6380062B1Method of fabricating semiconductor package having metal peg leads and connected by trace linesWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Apr 30, 2002·16 cites·18 claims
- 1068US6204553B1Lead frame structureWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Mar 20, 2001·40 cites·11 claims
- 1159US6650005B2Micro BGA packageWALSIN ADVANCED ELECTRONICS·Filed 2002·Granted Nov 18, 2003·10 cites·16 claims
- 1257US6078099ALead frame structure for preventing the warping of semiconductor package bodyWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Jun 20, 2000·24 cites·28 claims
- 1354US6486564B2Heat dissipation module for a BGA ICWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Nov 26, 2002·7 cites·19 claims
- 1444US6262475B1Lead frame with heat slugWALSIN ADVANCED ELECTRONICS·Filed 1999·Granted Jul 17, 2001·11 cites·18 claims
- 1543US6459162B1Encapsulated semiconductor die packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Granted Oct 1, 2002·3 cites·2 claims
- 1636US2003224542A1Method for making multi-chip packages and single chip packages simultaneously and structures from thereofWALSIN ADVANCED ELECTRONICS·Filed 2002·Application pending·0 cites
- 1733US2003001250A1TCP optical deviceWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 1830US2002173074A1Method for underfilling bonding gap between flip-chip and circuit substrateWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 1930US2003006055A1Semiconductor package for fixed surface mountingWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 2030US2002182773A1Method for bonding inner leads of leadframe to substrateWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 2129US2003100174A1Process for making a ball grid array semiconductor packageWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
- 2229US2002094683A1Method for manufacturing chip size package and its structureWALSIN ADVANCED ELECTRONICS·Filed 2001·Application pending·0 cites
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