Assignee
WAGNER RALPH
DE·3 granted patents·6 citations·filing 2010–2011
Top patents by PatentIndex Score
3 records- 0171US8796114B2Method for slicing a substrate waferWAGNER RALPH·Filed 2011·Granted Aug 5, 2014·3 cites·14 claims
- 0269US8946098B2Device for a laser lift-off method and laser lift-off methodWAGNER RALPH·Filed 2010·Granted Feb 3, 2015·2 cites·12 claims
- 0365US8932888B2Method of applying a conversion means to an optoelectronic semiconductor chip and an optoelectronic componentWAGNER RALPH·Filed 2011·Granted Jan 13, 2015·1 cites·12 claims
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